公开(公告)号：US06999301B1

公开(公告)日：2006-02-14

申请号：US11053522

申请日：2005-02-08

申请人： Henry M. Sanftleben ,  William W. Fultz ,  Eric M Berg ,  Morgan D. Murphy ,  Dennis P. Griffin

发明人： Henry M. Sanftleben ,  William W. Fultz ,  Eric M Berg ,  Morgan D. Murphy ,  Dennis P. Griffin

IPC分类号： H01G4/20

CPC分类号： G01G19/4142 ,  G01G7/06

摘要： A capacitive load cell apparatus includes upper and lower capacitor plates and an intermediate dielectric in the form of a synthetic knit spacer material having upper and lower fabric layers interconnected by an array of deflectable synthetic fibers. When occupant weight is applied to the seat, the synthetic fibers deflect to locally reduce the separation between the upper and lower capacitor plates, and the consequent change in capacitance is detected as a measure of the applied weight. The load cell or just the dielectric may be encased in a polymeric sheath to prevent intrusion of foreign matter, and a fluid such as silicone may be dispersed in woven dielectric.

摘要翻译： 电容式测力传感器装置包括上和下电容器板以及合成针织间隔物形式的中间电介质，其具有通过可偏转的合成纤维阵列互连的上和下织物层。 当乘员重量施加到座椅上时，合成纤维偏转以局部地减小上部和下部电容器板之间的间隔，并且随后的电容变化被检测为所施加的重量的量度。 称重传感器或只是电介质可以封装在聚合物护套中以防止异物侵入，并且诸如硅氧烷的流体可以分散在机织电介质中。

公开(公告)号：US07331106B2

公开(公告)日：2008-02-19

申请号：US11435211

申请日：2006-05-15

申请人： Derek B. Workman ,  Arun K. Chaundhuri ,  Eric M Berg

发明人： Derek B. Workman ,  Arun K. Chaundhuri ,  Eric M Berg

IPC分类号： H01L21/48 ,  H01L21/56 ,  H05K3/30

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/12042 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49176 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2924/3512

摘要： A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a filler material, and optionally a fluxing material onto the die surface. Together, the polymer matrix and filler materials define the filled underfill material in which the filler material is dispersed to reduce the coefficient of thermal expansion of the underfill material. The resulting underfill material surrounds but does not cover the solder bumps. The die is then placed on a substrate on which a second underfill material is present, forming a composite underfill layer that completely fills the space between the die and substrate and forms a fillet on a peripheral wall of the die.

摘要翻译： 用于将填充的底部填充材料选择性地沉积到模具表面上而不覆盖存在于管芯上的焊料凸块的工艺。 该方法需要将聚合物基质材料，填充材料以及任选的助熔材料微粒喷射到模具表面上。 聚合物基质和填料材料一起限定了填充材料分散在其中的填充的底部填充材料，以降低底部填充材料的热膨胀系数。 产生的底部填充材料围绕但不覆盖焊料凸块。 然后将模具放置在其上存在第二底部填充材料的基底上，形成完全填充模具和基底之间的空间的复合底部填充层，并在模具的周壁上形成圆角。