公开(公告)号：US12059739B2

公开(公告)日：2024-08-13

申请号：US17808908

申请日：2022-06-24

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Andre Schwöbel ,  Anton-Zoran Miric ,  Richard Wacker ,  Daniel Schnee

IPC分类号： F24H3/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/60

CPC分类号： B23K1/20 ,  B23K1/008 ,  H01L2021/60015

摘要： The present invention relates to a method for producing a metal-ceramic substrate. The method has the following steps: providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, wherein the solder material has: a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal; and heating the stack, wherein at least one of the following conditions is satisfied: the high temperature heating duration is no more than 60 min; the peak temperature heating duration is no more than 30 min; the heating duration is no more than 60 min.