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公开(公告)号：US12059739B2
公开(公告)日：2024-08-13
申请号：US17808908
申请日：2022-06-24
CPC分类号： B23K1/20 , B23K1/008 , H01L2021/60015
摘要： The present invention relates to a method for producing a metal-ceramic substrate. The method has the following steps: providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, wherein the solder material has: a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal; and heating the stack, wherein at least one of the following conditions is satisfied: the high temperature heating duration is no more than 60 min; the peak temperature heating duration is no more than 30 min; the heating duration is no more than 60 min.
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公开(公告)号：US20220037179A1
公开(公告)日：2022-02-03
申请号：US17309444
申请日：2019-11-21
IPC分类号： H01L21/673
摘要： The invention relates to a packaging unit for substrates, a packaging stack having packaging units of this type and a method for packaging substrates. The packaging unit for substrates comprises a first substrate, a spacer and a second substrate. The spacer is placed on the first substrate and the second substrate is placed on the spacer. A respective metal deposit is applied to a surface of the first substrate and to a surface of the second substrate and a respective adhesive point is arranged on the two metal deposits. The spacer is placed on the first substrate in such a way that the spacer is only in contact with the first substrate outside of the adhesive point. The spacer is bridge-shaped. At least the first substrate comprises a plurality of individual substrates arranged next to one another and the spacer borders the individual substrates.
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公开(公告)号：US20220022336A1
公开(公告)日：2022-01-20
申请号：US17309556
申请日：2019-11-21
摘要： The present invention relates to a packaging unit for a substrate, a package stack with such packaging units and a process for packaging a substrate. The packaging unit for a substrate comprises a first shell, a substrate and a second shell. The substrate is inserted into the first shell, and the second shell is mounted on the first shell so that a first side of the substrate is surrounded by the first shell and an opposite, second side of the substrate is covered by the second shell. A metal deposit is applied to the second side of the substrate and an adhesive point is arranged on the metal deposit. The second shell is supported on the first shell in such a way that the second shell is only in contact with the substrate outside the adhesive point.
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