公开(公告)号：US20240190079A1

公开(公告)日：2024-06-13

申请号：US18286121

申请日：2021-04-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lluis PARE BARNIOL ,  Oriol BORRELL CARBONELL ,  Daniel Alejandro POVEDA PI

IPC: B29C64/386 ,  B22F5/00 ,  B22F10/80 ,  B29L31/00 ,  B33Y50/00 ,  B33Y80/00 ,  G06T19/20

CPC classification number: B29C64/386 ,  B22F5/007 ,  B22F10/80 ,  B33Y50/00 ,  B33Y80/00 ,  G06T19/20 ,  B29L2031/757 ,  G06T2219/2021

Abstract: According to examples, a computer-readable medium may have stored thereon instructions that may cause a processor to obtain a first 3D model of a first portion of a component, the first 3D model may include a first digital attachment edge corresponding to a first attachment edge on the first portion. The processor may obtain a second 3D model of a second portion of the component, the second 3D model may include a second digital attachment edge corresponding to a second attachment edge on the second portion, in which the second portion is to be joined with the first portion to form the component. The processor may modify the first 3D model to include a first digital rib including holes along a segment of the first digital attachment edge and the second 3D model to include a second digital rib including protrusions along a segment of the second attachment edge.

公开(公告)号：US20240190080A1

公开(公告)日：2024-06-13

申请号：US18286128

申请日：2021-04-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lluis PARE BARNIOL ,  Oriol BORRELL CARBONELL ,  Daniel Alejandro POVEDA PI

IPC: B29C64/393 ,  B33Y10/00 ,  B33Y50/02

CPC classification number: B29C64/393 ,  B33Y10/00 ,  B33Y50/02

Abstract: According to examples, a non-transitory computer-readable medium may have stored thereon instructions that may cause a processor to obtain a three-dimensional (3D) model of a component to be fabricated by a 3D fabrication system, the 3D fabrication system having a build volume. The processor may also determine, based on a set of factors, a partitioning of the 3D model into separate sections, in which the separate sections may correspond to portions of the component that are sized to be fabricated within the build volume. The processor may further modify the 3D model to model the component as the separate sections.