公开(公告)号：US20230130339A1

公开(公告)日：2023-04-27

申请号：US17917968

申请日：2020-04-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jarrid WITTKOPF ,  Kristopher J. ERICKSON ,  Eric LUNA-RAMIREZ ,  James W. STASIAK

IPC: H01G13/00 ,  B29C64/165 ,  B29C64/393 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y30/00 ,  B33Y80/00

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to form a 3D printed capacitor on a body of the 3D printed object. The controller does this by controlling deposition of a conductive agent to form electrodes of the 3D printed capacitor and by controlling deposition of a dielectric agent in a dielectric region between the electrodes of the 3D printed capacitor.