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公开(公告)号:US20230130339A1
公开(公告)日:2023-04-27
申请号:US17917968
申请日:2020-04-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Jarrid WITTKOPF , Kristopher J. ERICKSON , Eric LUNA-RAMIREZ , James W. STASIAK
IPC: H01G13/00 , B29C64/165 , B29C64/393 , B33Y10/00 , B33Y50/02 , B33Y30/00 , B33Y80/00
Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to form a 3D printed capacitor on a body of the 3D printed object. The controller does this by controlling deposition of a conductive agent to form electrodes of the 3D printed capacitor and by controlling deposition of a dielectric agent in a dielectric region between the electrodes of the 3D printed capacitor.