公开(公告)号：US20240150590A1

公开(公告)日：2024-05-09

申请号：US18281502

申请日：2021-03-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting WU ,  Yong-Jun LI ,  Chi Hao CHANG ,  Xiao-Jun ZHU

IPC: C09D5/16 ,  C09D5/00 ,  C09D5/03 ,  C09D7/40 ,  C09D7/42 ,  C09D7/61 ,  C09D7/63 ,  C09D7/65 ,  G06F1/18 ,  H05K5/04

CPC classification number: C09D5/1637 ,  C09D5/002 ,  C09D5/035 ,  C09D5/1625 ,  C09D7/42 ,  C09D7/61 ,  C09D7/63 ,  C09D7/65 ,  C09D7/67 ,  G06F1/181 ,  H05K5/04

Abstract: A coated substrate for an electronic device can include a substrate, a basecoat layer on the substrate, and an anti-fingerprint topcoat layer on the basecoat layer. The substrate can include a metal or metal alloy. The basecoat layer can include pigment particles and a first one-part thermally cured polymeric resin. The anti-fingerprint topcoat layer can include a second one-part thermally cured polymeric resin and an anti-fingerprint material. The anti-fingerprint material can include a fluoropolymer, a silane, or a combination thereof. The basecoat layer can be cured before applying the anti-fingerprint topcoat layer on the basecoat layer.