公开(公告)号：US20150325527A1

公开(公告)日：2015-11-12

申请号：US14764005

申请日：2013-01-28

Applicant: Hewlett-Packard Development Company, LP.

Inventor： Paul Kessler Rosenberg ,  Michael Tan ,  Sagi Mathai

IPC: H01L23/544 ,  H01L21/82 ,  H01L25/00 ,  H01L21/3213

CPC classification number: H01L23/544 ,  G02B6/4231 ,  H01L21/32136 ,  H01L21/82 ,  H01L24/81 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/81139 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/10252 ,  H01L2924/10253

Abstract: A method includes growing a substrate material that includes an integrated circuit. The method includes forming an alignment post on the substrate material and forming a radiused top portion on the alignment post to enable alignment of a connector to the substrate material.

Abstract translation: 一种方法包括生长包括集成电路的衬底材料。 该方法包括在衬底材料上形成对准柱并在对准柱上形成圆弧顶部部分，以使连接器能够对准衬底材料。