摘要:
An interpolating process is performed on an input periodic signal using at least one first circuit board and a second board. Each first circuit board includes a partial circuit for performing the interpolating process. A plurality of these first boards can be mounted on the second board, and a divisional number of the interpolating process can be selected in accordance with the number of first boards mounted on the second board.
摘要:
A semiconductor device which includes an electrode portion formed on a wafer; a passivation film deposited on said wafer except for said electrode portion; an insulating film deposited only on said passivation film so as to have a predetermined thickness and so as to include a concave portion over said electrode portion; and conductive material embedded in said concave portion at least up to the height of said insulating film, wherein the conductive material is intended to be used for bonding to a substrate.
摘要:
A semiconductor device which includes an electrode portion formed on a wafer; a passivation film deposited on said wafer except for said electrode portion; an insulating film deposited only on said passivation film so as to have a predetermined thickness anad so as to include a concave portion over said electrode portion; and conductive material embedded in said concave portion at least up to the height of said insulating film, wherein the conductive material is intended to be used for bonding to a substrate.