摘要:
A semiconductor device which includes an electrode portion formed on a wafer; a passivation film deposited on said wafer except for said electrode portion; an insulating film deposited only on said passivation film so as to have a predetermined thickness and so as to include a concave portion over said electrode portion; and conductive material embedded in said concave portion at least up to the height of said insulating film, wherein the conductive material is intended to be used for bonding to a substrate.
摘要:
A semiconductor device which includes an electrode portion formed on a wafer; a passivation film deposited on said wafer except for said electrode portion; an insulating film deposited only on said passivation film so as to have a predetermined thickness anad so as to include a concave portion over said electrode portion; and conductive material embedded in said concave portion at least up to the height of said insulating film, wherein the conductive material is intended to be used for bonding to a substrate.
摘要:
In a method of forming a metallic silicide film on a substrate, a metallic silicide film containing silicon at a concentration higher than stoichiometric, is deposited on a substrate. A film of aluminum or aluminum alloy is then deposited on the metallic silicide film. Subsequently, a heat treatment is conducted to cause precipitation of silicon from the metallic silicide film to the aluminum, thereby to lower the silicon concentration in the silicide film.
摘要:
An Al layer (6) is first formed to cover an opening region (9) for interconnection in a semiconductor device. Then, an Al-Si-Ti layer (7) having a higher degree of hardness than that of the Al layer (6) is formed on the Al layer (6) and subsequently a mixture layer (8) of aluminum hydrate and aluminum oxide is formed on the surface of the Al-Si-Ti layer (7). Thus, a multilayered film of electrode and interconnection (11) is formed.
摘要:
A surface of a first aluminum interconnection layer in a connection hole is exposed to a plasma of oxygen or fluorine-containing gas during the forming step of the connection hole. In order to remove the thin deterioration layer which forms as a result, sputter etching is effected by an argon ion. There are residual particles of the oxide and fluoride of aluminum on the surface of the first aluminum interconnection layer. A titanium layer is formed on the insulating layer to be in contact with the surface of the first aluminum layer through the through hole. A titanium compound layer is formed on the titanium layer. A second aluminum layer is formed on the titanium compound layer. A heat treatment is effected to decompose the residual particles and to form an intermetallic compound (TiAl.sub.3).
摘要:
A semiconductor integrated circuit device has an interconnection structure in which multilayer aluminum interconnection layers are connected through a connection hole. A first aluminum interconnection layer is formed on a main surface of said semiconductor substrate. An insulating layer is formed on the first aluminum interconnection layer and has a through hole extending to a surface of the first aluminum interconnection layer. A second aluminum interconnection layer is formed on the insulating layer and is electrically connected to the first aluminum interconnection layer through the through hole. The second aluminum interconnection layer includes a titanium layer, a titanium nitride layer and an aluminum alloy layer. The titanium layer is formed on the insulating layer to be in contact with the surface of the first aluminum interconnection layer through the through hole. The titanium nitride layer is formed on the titanium layer. The aluminum alloy layer is formed on the titanium nitride layer. An electrical contact resistance between the first and second aluminum interconnection layers is stabilized, and resistance against the electron-migration and stress-migration is improved in the interconnection structure.
摘要:
A dump truck includes a body and a plurality of cameras. The body includes an upper deck and a main frame disposed in a longitudinal direction. The cameras are configured and arranged to obtain images to be combined to generate a bird's-eye image to monitor a periphery of the dump truck. The cameras include a front camera, a rear camera and side cameras. The front camera is disposed at the front of the upper deck to obtain an image of an area in front of the body. The rear camera is disposed at a rear end of the main frame to obtain an image of an area in rear of the body. The side cameras are respectively provided on left and right sides of the upper deck to obtain images of an area between diagonally to the front and diagonally to the rear of the body.
摘要:
A periphery monitoring apparatus for a work vehicle includes a plurality of obstacle detection sensors, a warning region setting section and a warning section. The obstacle detection sensors are mounted on the work vehicle, and each of the obstacle detection sensors is configured to determine a relative position of an obstacle with regard to the work vehicle by detecting the obstacle in the surroundings of the work vehicle. The warning region setting section is configured to set a warning region, where it is necessary to warn a driver of a presence of the obstacle, according to a movement state of the work vehicle. The warning section is configured to warn a driver that the relative position of the obstacle is positioned in the warning region.
摘要:
A periphery monitoring device (10) comprises a monitor (50) that displays a bird's-eye image (200) that includes an image of a dump truck (1), a payload meter ECU (21) that detects the load of the dump truck (1), and a controller (20) that switches the size of a cargo image (C1) displayed over the vessel (4) of the dump truck (1) and displays this image on the monitor (50) on the basis of the detection result of the payload meter ECU (21).In a load display device for a dump truck, a plurality of cameras are installed and the load display device monitors the periphery by using a bird's-eye image that combines images obtained by the plurality of cameras. The load display device includes a display component, a detector and a display controller. The display component is configured to display the bird's-eye image including an image of the dump truck. The detector is configured to detect a load of the dump truck. The display controller is configured to switch a size of a simulated cargo image displayed over a vessel of the dump truck based on a detection result of the detector and to display the simulated cargo image on the display component.
摘要:
An image correction method includes the steps of: acquiring a black-side intermediate luminance distribution as a luminance distribution in a region between a lowest luminance in a given intermediate luminance region in a luminance distribution of input image data in an image frame and a reference luminance provided in the center of the intermediate luminance region; determining a low-luminance-region input/output characteristic curve on the basis of the acquired black-side intermediate luminance distribution, the low-luminance-region input/output characteristic curve passing through a reference point, in the reference input/output characteristic line, determined in accordance with the reference luminance and through a minimum luminance point of the reference input/output characteristic line; and executing image correction on input image data having a luminance which is lower than the reference luminance on the basis of the determined low-luminance-region input/output characteristic curve.