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公开(公告)号：US20060138692A1
公开(公告)日：2006-06-29
申请号：US10545090
申请日：2004-01-23
申请人： Hidekazu Suzuki , Nobuyuki Tanaka , Noriyuki Miki , Hiroshi Yokoi , Keiichiro Onso , Reiji Matsuyama , Tomonobu Kasuga , Hisashi Mizuno , Manabu Maeda , Akira Takase , Takaharu Oi , Tomoni Suzuki , Minoru Matsumura , Yoshiyuki Aihara , Masashi Takemura , Taro Kita , Akio Saito , Kazuki Kamata , Masato Kikuchihara
发明人： Hidekazu Suzuki , Nobuyuki Tanaka , Noriyuki Miki , Hiroshi Yokoi , Keiichiro Onso , Reiji Matsuyama , Tomonobu Kasuga , Hisashi Mizuno , Manabu Maeda , Akira Takase , Takaharu Oi , Tomoni Suzuki , Minoru Matsumura , Yoshiyuki Aihara , Masashi Takemura , Taro Kita , Akio Saito , Kazuki Kamata , Masato Kikuchihara
IPC分类号： B29C33/40
CPC分类号： B29C39/34 , B22C7/02 , B22C9/04 , B22C9/10 , B29C33/3857 , B29C33/40 , B29C33/52 , B29C39/10 , B29C2791/001 , C08J9/0061 , C08J9/236 , C08J2375/04 , C08J2425/00
摘要： The present invention comprises a process for combining foamed polystyrene fine particles (C) to two-component reaction curing type soft urethane liquid resin (A), injecting a resulting mixture into a mold for core (C) with a concave portion corresponding to said hollow portion, hardening it, removing a resulting cured matter from said mold for core (C), and forming a vanishing core (D) having a shape corresponding to said hollow portion; a process for setting said vanishing core (D) at a specific position inside a mold for resin model (E) having a concave portion corresponding to an outer shape of said resin model, injecting two-component reaction fast curing type urethane liquid resin (F), hardening it, removing a resulting cured matter, and forming a resin model (G) including said vanishing core (D); and a process for injecting organic solvent capable of dissolving foamed polystyrene (H) into said vanishing core (D of said resin model (G) to dissolve said foamed polystyrene fine particles (B), removing a resulting solution, taking out and removing a cured matter (I) of said two-component reaction curing type soft urethane liquid resin (A), and completing said resin model.
摘要翻译： 本发明包括将发泡聚苯乙烯微粒（C）与双组分反应固化型软聚氨酯液体树脂（A）组合的方法，将所得混合物注入到用于芯（C）的模具中，其中凹部对应于所述中空 将其硬化，从芯（C）的所述模具中除去得到的固化物，并形成具有与所述中空部分相对应的形状的消失芯（D）; 将具有对应于所述树脂模型的外形的凹部的树脂模型（E）的模具内的特定位置处的所述消失芯（D）的设置方法，注入双组分反应快速固化型聚氨酯树脂（F ），硬化，除去所得的固化物，形成包含所述消泡芯（D）的树脂模型（G）; 以及将能够将发泡聚苯乙烯（H）溶解的有机溶剂注入所述消泡芯（D）的方法，以溶解所述发泡聚苯乙烯微粒（B），除去所得溶液，取出固化的 所述双组分反应固化型软质氨基甲酸酯液体树脂（A）的物质（I），并完成所述树脂模型。
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公开(公告)号：US08981420B2
公开(公告)日：2015-03-17
申请号：US11436026
申请日：2006-05-18
CPC分类号： H01L33/42 , H01L33/32 , H01L33/40 , H01L2924/0002 , H01L2924/00
摘要： A nitride semiconductor device includes a conductive oxide film with high reliability is provided. The nitride semiconductor device having a nitride semiconductor layer includes a conductive oxide film on the nitride semiconductor layer and a pad electrode on the conductive oxide film. The pad electrode includes a junction layer that contains a first metal and is in contact with the conductive oxide film, and a pad layer that contains a second metal.
摘要翻译： 氮化物半导体器件包括具有高可靠性的导电氧化物膜。 具有氮化物半导体层的氮化物半导体器件包括氮化物半导体层上的导电氧化物膜和导电氧化物膜上的焊盘电极。 焊盘电极包括含有第一金属并与导电氧化物膜接触的接合层和包含第二金属的焊盘层。
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公开(公告)号：US20060261355A1
公开(公告)日：2006-11-23
申请号：US11436026
申请日：2006-05-18
IPC分类号： H01L33/00
CPC分类号： H01L33/42 , H01L33/32 , H01L33/40 , H01L2924/0002 , H01L2924/00
摘要： A nitride semiconductor device includes a conductive oxide film with high reliability is provided. The nitride semiconductor device having a nitride semiconductor layer includes a conductive oxide film on the nitride semiconductor layer and a pad electrode on the conductive oxide film. The pad electrode includes a junction layer that contains a first metal and is in contact with the conductive oxide film, and a pad layer that contains a second metal.
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