公开(公告)号：US08049292B2

公开(公告)日：2011-11-01

申请号：US12404376

申请日：2009-03-16

申请人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Takahiro Iguchi ,  Hiroki Adachi ,  Shunpei Yamazaki

发明人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Takahiro Iguchi ,  Hiroki Adachi ,  Shunpei Yamazaki

IPC分类号： H01L31/048

CPC分类号： H01L27/14625 ,  H01L27/14806 ,  H01L31/075

摘要： A semiconductor device includes a plurality of semiconductor integrated circuits bonded to a structure body in which a fibrous body is impregnated with an organic resin. The plurality of semiconductor integrated circuits are provided at openings formed in the structure body and each include a photoelectric conversion element, a light-transmitting substrate which has stepped sides and in which the width of the projected section on a first surface side is smaller than that of a second surface, a semiconductor integrated circuit portion provided on the second surface of the light-transmitting substrate, and a chromatic color light-transmitting resin layer which covers the first surface and part of side surfaces of the light-transmitting substrate. The plurality of semiconductor integrated circuits include the chromatic color light-transmitting resin layers of different colors.

摘要翻译： 半导体器件包括多个半导体集成电路，该多个半导体集成电路与结构体结合，纤维体浸渍有机树脂。 多个半导体集成电路设置在形成在结构体中的开口处，并且各自包括光电转换元件，具有阶梯侧的透光基板，第一表面侧的突出部的宽度小于 设置在透光基板的第二表面上的半导体集成电路部分和覆盖透光基板的第一表面和侧表面的彩色透光树脂层。 多个半导体集成电路包括不同颜色的彩色透光树脂层。

公开(公告)号：US08507308B2

公开(公告)日：2013-08-13

申请号：US13244397

申请日：2011-09-24

申请人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Takahiro Iguchi ,  Hiroki Adachi ,  Shunpei Yamazaki

发明人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Takahiro Iguchi ,  Hiroki Adachi ,  Shunpei Yamazaki

IPC分类号： H01L31/18

CPC分类号： H01L27/14625 ,  H01L27/14806 ,  H01L31/075

摘要： A semiconductor device includes a plurality of semiconductor integrated circuits bonded to a structure body in which a fibrous body is impregnated with an organic resin. The plurality of semiconductor integrated circuits are provided at openings formed in the structure body and each include a photoelectric conversion element, a light-transmitting substrate which has stepped sides and in which the width of the projected section on a first surface side is smaller than that of a second surface, a semiconductor integrated circuit portion provided on the second surface of the light-transmitting substrate, and a chromatic color light-transmitting resin layer which covers the first surface and part of side surfaces of the light-transmitting substrate. The plurality of semiconductor integrated circuits include the chromatic color light-transmitting resin layers of different colors.

摘要翻译： 半导体器件包括多个半导体集成电路，该多个半导体集成电路与结构体结合，纤维体浸渍有机树脂。 多个半导体集成电路设置在形成在结构体中的开口处，并且各自包括光电转换元件，具有阶梯侧的透光基板，第一表面侧的突出部的宽度小于 设置在透光基板的第二表面上的半导体集成电路部分和覆盖透光基板的第一表面和侧表面的彩色透光树脂层。 多个半导体集成电路包括不同颜色的彩色透光树脂层。

公开(公告)号：US20090267173A1

公开(公告)日：2009-10-29

申请号：US12404376

申请日：2009-03-16

申请人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Takahiro Iguchi ,  Hiroki Adachi ,  Shunpei Yamazaki

发明人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Takahiro Iguchi ,  Hiroki Adachi ,  Shunpei Yamazaki

IPC分类号： H01L31/02 ,  H01L21/50

CPC分类号： H01L27/14625 ,  H01L27/14806 ,  H01L31/075

摘要： A semiconductor device includes a plurality of semiconductor integrated circuits bonded to a structure body in which a fibrous body is impregnated with an organic resin. The plurality of semiconductor integrated circuits are provided at openings formed in the structure body and each include a photoelectric conversion element, a light-transmitting substrate which has stepped sides and in which the width of the projected section on a first surface side is smaller than that of a second surface, a semiconductor integrated circuit portion provided on the second surface of the light-transmitting substrate, and a chromatic color light-transmitting resin layer which covers the first surface and part of side surfaces of the light-transmitting substrate. The plurality of semiconductor integrated circuits include the chromatic color light-transmitting resin layers of different colors.

摘要翻译： 半导体器件包括多个半导体集成电路，该多个半导体集成电路与结构体结合，纤维体浸渍有机树脂。 多个半导体集成电路设置在形成在结构体中的开口处，并且各自包括光电转换元件，具有阶梯侧的透光基板，第一表面侧的突出部的宽度小于 设置在透光基板的第二表面上的半导体集成电路部分和覆盖透光基板的第一表面和侧表面的彩色透光树脂层。 多个半导体集成电路包括不同颜色的彩色透光树脂层。

公开(公告)号：US08227886B2

公开(公告)日：2012-07-24

申请号：US12358449

申请日：2009-01-23

申请人： Hidekazu Takahashi ,  Yohei Monma ,  Daiki Yamada ,  Takahiro Iguchi ,  Kazuo Nishi

发明人： Hidekazu Takahashi ,  Yohei Monma ,  Daiki Yamada ,  Takahiro Iguchi ,  Kazuo Nishi

IPC分类号： H01L31/09

CPC分类号： H01L31/02162 ,  H01L25/0655 ,  H01L27/14621 ,  H01L27/14643 ,  H01L2924/0002 ,  H01L2924/00

摘要： An object is to reduce the breakage of appearance such as a crack, a split and a chip by external stress of a semiconductor device. Another object is that manufacturing yield of a thin semiconductor device increases. The semiconductor device includes a plurality of semiconductor integrated circuits mounted on the interposer. Each of the plurality of semiconductor integrated circuits includes a light transmitting substrate which have a step on the side surface and in which the width of one section of the light transmitting substrate is narrower than that of the other section of the light transmitting substrate when the light transmitting substrate is divided at a plane including the step, a semiconductor element layer including a photoelectric conversion element provided on one surface of the light transmitting substrate, and a chromatic color light transmitting resin layer which covers the other surface of the light transmitting substrate and a part of the side surface. The colors of the chromatic color light transmitting resin layers are different in each of the plurality of semiconductor integrated circuits.

摘要翻译： 目的是通过半导体器件的外部应力来减少裂纹，裂纹和芯片的外观破损。 另一个目的是提高薄半导体器件的制造成品率。 半导体器件包括安装在插入器上的多个半导体集成电路。 所述多个半导体集成电路中的每一个都包括透光基板，所述透光基板在所述侧表面具有台阶，并且所述透光基板的一部分的宽度比所述透光基板的另一部分的宽度窄，当所述光 发送基板在包括该台阶的平面处被分割，包括设置在透光基板的一个表面上的光电转换元件的半导体元件层和覆盖透光基板的另一个表面的彩色透光树脂层和 侧面的一部分。 多色半导体集成电路中的彩色透光树脂层的颜色不同。

公开(公告)号：US20090274528A1

公开(公告)日：2009-11-05

申请号：US12226254

申请日：2006-10-23

申请人： Takahiro Iguchi ,  Takayuki Nakajima

发明人： Takahiro Iguchi ,  Takayuki Nakajima

IPC分类号： B23B51/02

CPC分类号： B23B51/02 ,  B23B2251/14 ,  B23B2251/18 ,  B23B2251/202 ,  Y10T408/909 ,  Y10T408/9097

摘要： A drill achieves a long tool life while improving a property for discharging chips. The drill includes: a columnar body which is rotated about an axis; a plurality of cutting edges each being formed at a tip end portion of the body; and a plurality of thinning edges each being formed in conjunction with the cutting edge nearer the axis by providing thinnings at the tip end portion of the body. At least one of the plurality of thinning edges is provided with a concave portion that is formed by cutting the thinning edge to be recessed in a semicircular shape toward the rear side in the rotational direction, and a center of the semicircular-shaped concave portion is provided on a line extended from the tip end portion of the thinning edge when viewed from a tip end direction of the body.

摘要翻译： 钻头实现了长的刀具寿命，同时提高了排屑的性能。 钻头包括：围绕轴线旋转的柱状体; 多个切削刃各自形成在所述主体的前端部; 并且通过在所述主体的前端部分处提供薄片，所述多个薄化边缘通过与所述切割边缘相邻的方式形成。 多个变薄边缘中的至少一个设置有凹部，该凹部通过沿着旋转方向朝向后侧切割成半圆形的变薄边缘而形成，并且半圆形凹部的中心为 设置在从所述主体的前端方向观察时从所述变薄边缘的前端部延伸的线上。

公开(公告)号：US08132989B2

公开(公告)日：2012-03-13

申请号：US12226254

申请日：2006-10-23

申请人： Takahiro Iguchi ,  Takayuki Nakajima

发明人： Takahiro Iguchi ,  Takayuki Nakajima

IPC分类号： B23B51/02

CPC分类号： B23B51/02 ,  B23B2251/14 ,  B23B2251/18 ,  B23B2251/202 ,  Y10T408/909 ,  Y10T408/9097

摘要： A drill achieves a long tool life while improving a property for discharging chips. The drill includes: a columnar body which is rotated about an axis; a plurality of cutting edges each being formed at a tip end portion of the body; and a plurality of thinning edges each being formed in conjunction with the cutting edge nearer the axis by providing thinnings at the tip end portion of the body. At least one of the plurality of thinning edges is provided with a concave portion that is formed by cutting the thinning edge to be recessed in a semicircular shape toward the rear side in the rotational direction, and a center of the semicircular-shaped concave portion is provided on a line extended from the tip end portion of the thinning edge when viewed from a tip end direction of the body.

摘要翻译： 钻头实现了长的刀具寿命，同时提高了排屑的性能。 钻头包括：围绕轴线旋转的柱状体; 多个切削刃各自形成在所述主体的前端部; 并且通过在所述主体的前端部分处提供薄片，所述多个薄化边缘通过与所述切割边缘相邻的方式形成。 多个变薄边缘中的至少一个设置有凹部，该凹部通过沿着旋转方向朝向后侧切割成半圆形的变薄边缘而形成，并且半圆形凹部的中心是 设置在从所述主体的前端方向观察时从所述变薄边缘的前端部延伸的线上。