公开(公告)号：US5114468A

公开(公告)日：1992-05-19

申请号：US474748

申请日：1990-03-23

申请人： Hidetoshi Akutsu ,  Tohru Kohno ,  Masato Otsuki

发明人： Hidetoshi Akutsu ,  Tohru Kohno ,  Masato Otsuki

IPC分类号： C22C1/04 ,  C22C32/00 ,  F01L3/08 ,  F02F7/00

CPC分类号： F02F7/0087 ,  C22C1/0425 ,  C22C32/0021 ,  F01L3/08 ,  F02F7/0085 ,  F05C2201/0475 ,  F05C2201/0496

摘要： The present invention relates to a Cu-based sintered alloy which has a composition containing: Zn: 10-40%; Al: 0.3%-6% oxygen: 0.03-1%; any one selected, as an additional element from the group including at least one of Fe, Ni and Co: 0.1-5%, Mn: 0.1-5%, Si: 0.1-3%, and at least one of W and Mo: 0.1-3%; and the remainder including Cu and inevitable impurities. The alloy is superior in wear resistance particularly in air at temperatures ranging from the ordinary temperature to 400.degree. C., has high strength and high toughness, and further excels in the uniform temporal change characteristics with associated members, as evaluated by its friction coefficient. The invention relates also to parts for automotive equipment made of this Cu-base sintered alloy, such as synchronizer rings for transmission, valveguides for engines, bearings for turbo-chargers and so forth.

摘要翻译： PCT No.PCT / JP89 / 01098 Sec。 371 1990年3月23日 102（e）1990年3月23日PCT PCT 1989年10月26日PCT公布。 出版物WO90 / 04657 日期：1990年5月3日。本发明涉及一种Cu基烧结合金，其组成为：Zn：10-40％ Al：0.3％-6％氧气：0.03-1％; 选自Fe，Ni和Co中的至少一种：0.1-5％，Mn：0.1-5％，Si：0.1-3％，以及W和Mo中的至少一种： 0.1-3％; 余量包括Cu和不可避免的杂质。 该合金在常温至400℃的温度范围内，特别是在空气中具有优异的耐磨性，具有高强度和高韧性，并且通过其摩擦系数进行评估，进一步优于相关构件的均匀时间变化特性。 本发明还涉及由该Cu基烧结合金制成的汽车设备的部件，例如用于变速器的同步环，用于发动机的阀导向器，用于涡轮增压器的轴承等。

公开(公告)号：US4749548A

公开(公告)日：1988-06-07

申请号：US903514

申请日：1986-09-03

申请人： Hidetoshi Akutsu ,  Takuro Iwamura ,  Masao Kobayashi

发明人： Hidetoshi Akutsu ,  Takuro Iwamura ,  Masao Kobayashi

IPC分类号： C22C9/00 ,  H01L23/495 ,  C07C9/00

CPC分类号： C22C9/00 ,  H01L23/49579 ,  H01L2924/0002

摘要： Copper alloy lead materials used in the fabrication of semiconductor devices such as ICs and LSIs are required to have a tensile strength of 40 kgf/mm.sup.2 or more, an elongation of 4% or more, an electrical conductivity of 50% IACS or more, and a softening point of 400.degree. C. or higher.The copper alloy lead material of the present invention exhibits even higher degrees of tensile strength and elongation and yet satisfy the values of electrical conductivity and softening point that are required for Cu alloy lead materials to be used with ordinary semiconductor devices. Therefore, the Cu alloy lead material of the present invention is applicable not only to ordinary semiconductor devices but also to those with higher packing densities while displaying equally superior performance.

摘要翻译： 用于制造半导体器件如IC和LSI的铜合金铅材料需要具有40kgf / mm 2以上的拉伸强度，4％以上的伸长率，IACS以上的导电率为50％以上，以及 软化点在400℃以上。 本发明的铜合金铅材料具有更高的拉伸强度和伸长率，并且还满足与普通半导体器件一起使用的Cu合金铅材料所需的导电性和软化点的值。 因此，本发明的Cu合金铅材料不仅适用于普通的半导体器件，而且也适用于具有较高包装密度的那些，同时具有优异的性能。

公开(公告)号：US4872048A

公开(公告)日：1989-10-03

申请号：US166217

申请日：1988-03-10

申请人： Hidetoshi Akutsu ,  Takuro Iwamura ,  Masao Kobayashi

发明人： Hidetoshi Akutsu ,  Takuro Iwamura ,  Masao Kobayashi

IPC分类号： C22C9/00 ,  H01L23/495

CPC分类号： C22C9/00 ,  H01L23/49579 ,  H01L2924/0002

摘要： A semiconductor device having leads of high strength and elongation and which consist essentially of a copper alloy that contains 0.05-1% of Cr, 0.005-0.3% of Zr, 0.001-0.05% of Li, 0-1% of Ni, 0-1% of Sn, 0-1% of Ti, 0-0.1% of Si and 0.001-0.3% of at least one element selected from the group consisting of P, Mg, Al, Zn and Mn, with the balance being Cu and no more than 0.1% of incidental impurities, the percent being on a weight basis. The invention also provides a semiconductor device having leads of high strength and elongation and which consist essentially of a copper alloy that contains either 0.05-1% of Cr or 0.005-0.3% of Zr or both, 0.001-0.05% of Li, 0-1% of Ni, 0-1% of Sn, 0-1% of Ti, 0-0.1% of Si and which further contains one or more of 0-2% of a metal selected from the group consisting of Fe, Co and Be, 0-1% of a metal selected from the group consisting of Mg, Al, Zn, Mn, B, P, Y and a rare earth element, and 0-2% of a metal selected from the group consisting of Nb, V, Ta, Hf, Mo and W, the percent being on a weight basis, with the balance being copper and incidental impurities, and which has a structure wherein the average grain size of any eutectic crystal present is no more than 10 .mu.m, the average grain size of any precipitate present is no more than 0.1 .mu.m, and the average size of any crystalline grains present is no more than 50 .mu.m.

摘要翻译： 具有高强度和伸长率的导线的半导体器件，其基本上由铜合金组成，该铜合金含有0.05-1％的Cr，0.005-0.3％的Zr，0.001-0.05％的Li，0-1％的Ni， 1％Sn，0-1％Ti，0-0.1％Si和0.001-0.3％选自P，Mg，Al，Zn和Mn中的至少一种元素，余量为Cu和 不超过0.1％的偶然杂质，百分比在重量的基础上。 本发明还提供一种具有高强度和伸长率的导线的半导体器件，其基本上由含有0.05-1％的Cr或0.005-0.3％的Zr或两者的铜合金组成，0.001-0.05％的Li， 1％的Ni，0-1％的Sn，0-1％的Ti，0-0.1％的Si，并且还含有一种或多种选自Fe，Co的0-2％的金属和 Be，选自Mg，Al，Zn，Mn，B，P，Y和稀土元素的金属的0-1％，以及0-2％的选自Nb， V，Ta，Hf，Mo和W，百分数在重量的基础上，余量为铜和附带杂质，并且具有其中存在的任何共晶晶体的平均晶粒尺寸不大于10μm的结构， 存在的任何沉淀物的平均晶粒尺寸不大于0.1μm，任何晶粒的平均尺寸不超过50μm。

公开(公告)号：US4995924A

公开(公告)日：1991-02-26

申请号：US416867

申请日：1989-10-04

申请人： Hidetoshi Akutsu

发明人： Hidetoshi Akutsu

IPC分类号： C22C9/04 ,  F16D23/02

CPC分类号： C22C9/04 ,  F16D23/025

摘要： A novel synchronizer ring for use in a speed variator that is made of a Cu base alloy and which exhibits good initial accommodation by mating surfaces while ensuring high wear resistance is disclosed. The ring is made of a Cu base alloy containing 20-40% Zn (all percents being on a weight basis), 2-8% Al, and at least two components (intermetallic compound forming components) selected from among the following five elements, i.e., 0.1-3% of at least one of Ti, Zr and Cr, 0.1-3% Sn, 0.1-6% of at least one of Fe, Ni and Co, 0.1-5% Mn and 0.2-2% Si, and optionally at least one additional component that differs from said selected two components and which is selected from among 0-5% Mn, 0-3% Sn and 0-3% of at least one of Ti, Zr and Cr, and the balance being Cu and incidental impurities. The ring also has either an oxide film layer of aluminum oxide base with an average thickness of 0.1-10 .mu.m or a work-hardened layer with an average thickness of 5-300 .mu.m formed on the surface of the ring where it is to contact a mating member.

摘要翻译： 公开了一种用于由Cu基合金制成的变速器并且通过配合表面具有良好的初始调节而确保高耐磨性的新型同步环。 该环由含有20-40％Zn（全部以重量计），2-8％Al和至少两种选自以下五种元素中的组分（金属间化合物形成组分）的Cu基合金制成， 即，Ti，Zr和Cr中的至少一种，0.1-3％的Sn，0.1-6％的Fe，Ni和Co，0.1-5％的Mn和0.2-2％的Si中的至少一种的0.1-3％ 和任选的至少一种与所选择的两种组分不同的附加组分，其选自0-5％Mn，0-3％Sn和0-3％的Ti，Zr和Cr中的至少一种，余量 是铜和杂质。 该环还具有平均厚度为0.1-10μm的氧化铝基底的氧化物膜层或在其表面上形成的平均厚度为5-300μm的硬化层，其中， 接触配对部件。

公开(公告)号：US4943321A

公开(公告)日：1990-07-24

申请号：US164534

申请日：1988-03-07

申请人： Hidetoshi Akutsu

发明人： Hidetoshi Akutsu

IPC分类号： C22C33/02 ,  F16D23/02

CPC分类号： C22C33/0264 ,  F16D23/025 ,  B22F2998/00

摘要： A novel synchronizer ring for use in speed variators that is made of an iron-base sintered alloy and which has high strength and wear resistance while exhibiting good accommodation by the mating surface is disclosed. This synchronizer ring is made of an iron-base sintered alloy that contains 0.1-0.9 wt % C., and at least one optional element selected from among 0.1-6 wt % of at least one of Mn, Cr and Mo, 0.1-6 wt % of at least one of Ni and Cu, and 0.02-0.5 wt % B, the balance being Fe and incidental impurities (Si, S and P as incidental impurities being present in a total amount not exceeding 0.5 wt %), and which has a porosity of 0.05-5 vol %. The properties of this ring, notably its wear resistance, can be further improved by forming either a hard Ni-P compound layer or a nitrided layer on at least the surface of the above-specified sintered alloy which is to make sliding contact with a tapered cone.

摘要翻译： 公开了一种用于由铁基烧结合金制成并且具有高强度和耐磨性同时通过配合表面良好调节的变速器的新型同步器环。 该同步环由含有0.1-0.9重量％的C的铁基烧结合金和至少一种选自Mn，Cr和Mo中的至少一种的0.1-6重量％的任选元素，0.1-6重量％ 重量％的Ni和Cu中的至少一种，以及0.02-0.5重量％的B，余量为Fe和偶然杂质（Si，S和P作为杂质总量不超过0.5重量％），其中 具有0.05-5体积％的孔隙率。 该环的特性，特别是其耐磨性，可以通过在上述指定的烧结合金的至少表面上形成硬的Ni-P化合物层或氮化层来进一步改善，该烧结合金的表面将与锥形 锥体。

公开(公告)号：US4874439A

公开(公告)日：1989-10-17

申请号：US157634

申请日：1988-02-18

申请人： Hidetoshi Akutsu

发明人： Hidetoshi Akutsu

IPC分类号： C22C9/04 ,  F16D23/02

CPC分类号： C22C9/04 ,  F16D23/025

摘要： A synchronizer ring for use in an automotive speed variator. The ring not only has high strength and toughness but also exhibits high wear resistance, as well as good synchronizing characteristics with respect to a mating member as expressed in terms of friction coefficient. The Cu alloy of which this ring is made has one of the following compositions: (1) 17-40% Zn (all percents are on a weight basis), 2-11% Al and 50-3,000 ppm of oxygen, as well as 0.1-3.5% of at least one element selected from among Ti, Zr and V, 0.003-0.3% Mg and with at least one optional element selected from among Fe, Ni, Co, P, Ca, Mn, Sn, Si and Pb, the balance being Cu and incidental impurities; or (2) 17-40% Zn, 2-11% Al, 0.5-6% Mn, 0.1-2% Si, 0.1-3% of at least one of Fe, Ni and Co, 0.003-0.3% of Mg, and 30-1,000 ppm of oxygen, with at least one optional element selected from among P, Ca, Cr, Pb and Sn, and with the balance being Cu and incidental impurities. In these two compositions, intermetallic compounds and oxides are uniformly dispersed in the matrix.

摘要翻译： 用于汽车变速器的同步环。 该环不仅具有高强度和韧性，而且表现出高的耐磨性，以及相对于以摩擦系数表示的配合构件的良好的同步特性。 制造该环的Cu合金具有以下组成之一：（1）17-40％Zn（全部以重量计），2-11％Al和50-3,000ppm氧，以及 选自Ti，Zr和V中的至少一种元素的0.1-3.5％，0.003-0.3％的Mg和选自Fe，Ni，Co，P，Ca，Mn，Sn，Si和Pb中的至少一种任选元素 余量为铜和杂质; 或（2）17-40％Zn，2-11％Al，0.5-6％Mn，0.1-2％Si，0.1-3％的Fe，Ni和Co中的至少一种，0.003-0.3％的Mg， 和30-1000ppm的氧，其中选自P，Ca，Cr，Pb和Sn中的至少一种任选元素，余量为Cu和偶然杂质。 在这两种组合物中，金属间化合物和氧化物均匀分散在基质中。