公开(公告)号：US5521523A

公开(公告)日：1996-05-28

申请号：US165940

申请日：1993-12-14

申请人： Hidetoshi Kimura ,  Tetsuya Utsunomiya ,  Chiaki Mochizuki

发明人： Hidetoshi Kimura ,  Tetsuya Utsunomiya ,  Chiaki Mochizuki

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R1/07342 ,  G01R1/06705 ,  G01R31/2863

摘要： A probe card assembly thermal influenced from a wafer with which a probe makes contact during a probe test. The assembly includes a probe card unit having a great number of probes to be brought into contact with the wafer to be tested, and a holder for holding the probe card unit at a center portion thereof. The holder includes a ring member, supported by another member, for supporting the probe card unit from a low side, and a cutout stepped member and a slot hole for relaxing stress due to thermal expansion concentrated on the ring member.

摘要翻译： 在探针测试期间，探针卡片组件受热影响，探针与探针接触。 该组件包括具有大量待测试晶片接触的探头的探针卡单元和用于将探针卡单元保持在其中心部分的保持器。 保持器包括由另一构件支撑的环构件，用于从低侧支撑探针卡单元，以及切口阶梯构件和用于将集中在环构件上的热膨胀的应力放松的切口阶梯构件和狭槽孔。