Process for preparing nano-porous metal oxide semiconductor layers
    1.
    发明授权
    Process for preparing nano-porous metal oxide semiconductor layers 失效
    制备纳米多孔金属氧化物半导体层的方法

    公开(公告)号:US06929970B2

    公开(公告)日:2005-08-16

    申请号:US10659982

    申请日:2003-09-11

    IPC分类号: H01G9/20 H01L21/00 H01L25/00

    摘要: A process for preparing a layer of a nano-porous metal oxide semiconductor comprising the steps of: (i) providing metal oxide semiconductor nano-particles prepared by a wet precipitation process, (ii) heating said nano-particles at a temperature in the range of 250 to 600° C., (iii) preparing a dispersion of said heat-treated nano-particles from step (ii), (iv) applying said dispersion prepared in step (iii) to a support to produce a coating; and (v) subjecting said coating to a pressure in the range of 100 to 1000 bar at a temperature below 250° C.; a layer of a nano-porous metal oxide semiconductor obtained by this process; and a photovoltaic device comprising a layer of a nano-porous metal oxide semiconductor obtained by this process.

    摘要翻译: 一种制备纳米多孔金属氧化物半导体层的方法,包括以下步骤:(i)提供通过湿沉淀法制备的金属氧化物半导体纳米颗粒,(ii)在该范围内的温度下加热所述纳米颗粒 (iii)制备来自步骤(ii)的所述经热处理的纳米颗粒的分散体,(iv)将步骤(iii)中制备的所述分散体施加到载体上以产生涂层; 和(v)在低于250℃的温度下对所述涂层进行100-1000巴范围内的压力; 通过该方法获得的纳米多孔金属氧化物半导体层; 以及包括通过该方法获得的纳米多孔金属氧化物半导体层的光伏器件。

    Process for preparing nano-porous metal oxide semiconductor layers

    公开(公告)号:US20050016577A1

    公开(公告)日:2005-01-27

    申请号:US10659982

    申请日:2003-09-11

    IPC分类号: H01G9/20 H01L21/00 H01L25/00

    摘要: A process for preparing a layer of a nano-porous metal oxide semiconductor comprising the steps of: (i) providing metal oxide semiconductor nano-particles prepared by a wet precipitation process, (ii) heating said nano-particles at a temperature in the range of 250 to 600° C., (iii) preparing a dispersion of said heat-treated nano-particles from step (ii), (iv) applying said dispersion prepared in step (iii) to a support to produce a coating; and (v) subjecting said coating to a pressure in the range of 100 to 1000 bar at a temperature below 250° C.; a layer of a nano-porous metal oxide semiconductor obtained by this process; and a photovoltaic device comprising a layer of a nano-porous metal oxide semiconductor obtained by this process.

    Method for treating a metal oxide layer
    3.
    发明授权
    Method for treating a metal oxide layer 失效
    处理金属氧化物层的方法

    公开(公告)号:US08349642B2

    公开(公告)日:2013-01-08

    申请号:US12936187

    申请日:2009-04-06

    IPC分类号: H01L21/00 H01L21/44

    摘要: The invention relates to a method for treating a metal oxide layer deposited on a substrate. The method comprises the step of applying a substantially atmospheric plasma process at a relatively low temperature. Preferably, the temperature during the plasma process is lower than approximately 180° C. Further, the atmospheric plasma process can be applied in a plasma chamber comprising H2 gas and He gas.

    摘要翻译: 本发明涉及一种处理沉积在基底上的金属氧化物层的方法。 该方法包括在较低温度下施加基本上大气中的等离子体工艺的步骤。 优选地,等离子体工艺期间的温度低于约180℃。此外,大气等离子体工艺可以施加在包括H 2气体和He气体的等离子体室中。

    METHOD FOR TREATING A METAL OXIDE LAYER
    4.
    发明申请
    METHOD FOR TREATING A METAL OXIDE LAYER 失效
    用于处理金属氧化物层的方法

    公开(公告)号:US20110104885A1

    公开(公告)日:2011-05-05

    申请号:US12936187

    申请日:2009-04-06

    IPC分类号: H01L21/283

    摘要: The invention relates to a method for treating a metal oxide layer deposited on a substrate. The method comprises the step of applying a substantially atmospheric plasma process at a relatively low temperature. Preferably, the temperature during the plasma process is lower than approximately 180° C. Further, the atmospheric plasma process can be applied in a plasma chamber comprising H2 gas and He gas.

    摘要翻译: 本发明涉及一种处理沉积在基底上的金属氧化物层的方法。 该方法包括在较低温度下施加基本上大气中的等离子体工艺的步骤。 优选地,等离子体工艺期间的温度低于约180℃。此外,大气等离子体工艺可以施加在包括H 2气体和He气体的等离子体室中。