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公开(公告)号：US20150284241A1
公开(公告)日：2015-10-08
申请号：US14743678
申请日：2015-06-18
Applicant: Himax Display, Inc.
Inventor： Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
CPC classification number: B81C1/00269 , B81B7/0041 , B81B7/0058 , B81B2201/042 , B81C2203/019 , G02B26/0833 , G02B27/0006 , H01L2924/16195 , H01L2924/16235
Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.
Abstract translation: MEMS封装结构包括基座，MEMS器件，第一盖，第二盖和玻璃料。 底座包括一个凹槽。 MEMS器件设置在凹部中。 第一盖设置在凹部中并覆盖MEMS装置。 第二盖设置在基座上并覆盖凹部。 玻璃料布置在基部和第二盖之间。 MEMS封装结构包括基座，MEMS器件，第一盖，第二盖，第一金属框架和第一密封介质。 第一金属框架设置在第二盖周围，并且第二盖和第一金属框架共同设置在基座上并覆盖凹部。 第一密封介质设置在第一金属框架和基座之间。 进一步提供上述MEMS封装结构的制造方法。
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公开(公告)号：US09624097B2
公开(公告)日：2017-04-18
申请号：US15199604
申请日：2016-06-30
Applicant: Himax Display, Inc.
Inventor： Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
CPC classification number: B81C1/00269 , B81B7/0041 , B81B7/0058 , B81B2201/042 , B81C2203/019 , G02B26/0833 , G02B27/0006 , H01L2924/16195 , H01L2924/16235
Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.
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公开(公告)号：US20160311678A1
公开(公告)日：2016-10-27
申请号：US15199604
申请日：2016-06-30
Applicant: Himax Display, Inc.
Inventor： Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
IPC: B81C1/00
CPC classification number: B81C1/00269 , B81B7/0041 , B81B7/0058 , B81B2201/042 , B81C2203/019 , G02B26/0833 , G02B27/0006 , H01L2924/16195 , H01L2924/16235
Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.
Abstract translation: 微机电系统（MEMS）封装结构的制造方法包括提供基座，其中所述基座包括凹部; 在所述凹部中设置芯片，其中所述芯片具有活性表面; 在所述凹部中的所述有源表面上设置MEMS器件，其中所述MEMS器件被第一盖覆盖，所述第一盖包括空腔，并且所述MEMS器件位于所述腔中; 在芯片和第一盖之间的周边间隙处设置密封剂以密封空腔; 将玻璃料放置在第二盖或基底上; 将第二盖设置在基座上，其中第二盖覆盖凹部，玻璃料布置在基座和第二盖之间; 并加热玻璃料以密封凹部。
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公开(公告)号：US09409766B2
公开(公告)日：2016-08-09
申请号：US14743678
申请日：2015-06-18
Applicant: Himax Display, Inc.
Inventor： Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
CPC classification number: B81C1/00269 , B81B7/0041 , B81B7/0058 , B81B2201/042 , B81C2203/019 , G02B26/0833 , G02B27/0006 , H01L2924/16195 , H01L2924/16235
Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.
Abstract translation: MEMS封装结构包括基座，MEMS器件，第一盖，第二盖和玻璃料。 底座包括一个凹槽。 MEMS器件设置在凹部中。 第一盖设置在凹部中并覆盖MEMS装置。 第二盖设置在基座上并覆盖凹部。 玻璃料布置在基部和第二盖之间。 MEMS封装结构包括基座，MEMS器件，第一盖，第二盖，第一金属框架和第一密封介质。 第一金属框架设置在第二盖周围，并且第二盖和第一金属框架共同设置在基座上并覆盖凹部。 第一密封介质设置在第一金属框架和基座之间。 进一步提供上述MEMS封装结构的制造方法。
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