公开(公告)号：US20180044171A1

公开(公告)日：2018-02-15

申请号：US15673118

申请日：2017-08-09

申请人： Robert Bosch GmbH

发明人： Achim Breitling ,  Christof Schwenk ,  Hartmut Kueppers ,  Nicole Schittenhelm ,  Volker Schmitz

IPC分类号： B81B7/00

CPC分类号： B81B7/0038 ,  B81B7/0041 ,  B81B7/02 ,  B81C1/00285 ,  G01C19/56 ,  G01P3/00 ,  G01P15/00 ,  G01P15/0802

摘要： A micromechanical component having a main extension plane is provided; the micromechanical component encloses a first cavern and a second cavern, and a first pressure prevails in the first cavern while a second pressure prevails in the second cavern, and a first layer of the micromechanical component, which extends essentially parallel to the main extension plane, projects into a second layer of the micromechanical component, which extends essentially parallel to the main extension plane, between the first cavern and the second cavern, essentially in a perpendicular direction to the main extension plane.

公开(公告)号：US20170362079A1

公开(公告)日：2017-12-21

申请号：US15540149

申请日：2015-10-30

申请人： Mitsubishi Electric Corporation

发明人： Nobuaki KONNO ,  Yoshiaki HIRATA

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0041 ,  B81B7/0077 ,  B81B7/02 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/092 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00158 ,  B81C1/00293 ,  B81C2201/0197 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/031 ,  B81C2203/0785 ,  H01L23/02 ,  H01L23/04 ,  H01L23/08 ,  H01L23/12 ,  H01L23/15 ,  H01L25/00 ,  H05K3/46

摘要： A ceramic substrate is mainly constituted of ceramic, and has a first main surface and a second main surface located opposite to the first main surface. A recessed portion recessed toward a first main surface side is formed in the second main surface. A wire portion extending from an outer peripheral surface of the ceramic substrate to inside of the recessed portion is formed, and a bottom portion located on the first main surface side in the recessed portion has a portion thinner than another portion of the ceramic substrate other than the bottom portion.

公开(公告)号：US09802816B2

公开(公告)日：2017-10-31

申请号：US14860505

申请日：2015-09-21

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chang-Chia Chang ,  Chen-Chih Fan ,  Bruce C. S. Chou

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L29/84 ,  B81B3/00

CPC分类号： B81C1/00269 ,  B81B3/0018 ,  B81B3/0067 ,  B81B3/007 ,  B81B7/00 ,  B81B7/0006 ,  B81B7/0016 ,  B81B7/0029 ,  B81B7/0041 ,  B81B7/0051 ,  B81B7/0058 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/025 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00 ,  B81C1/00293 ,  B81C1/00325 ,  B81C2203/0118

摘要： A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.

公开(公告)号：US09802814B2

公开(公告)日：2017-10-31

申请号：US15218852

申请日：2016-07-25

申请人： Fairchild Semiconductor Corporation

发明人： David Lambe Marx ,  Brian Bircumshaw ,  Janusz Bryzek

IPC分类号： B81B7/00 ,  H01L23/48 ,  H01L29/84 ,  G01P15/18 ,  G01P15/125 ,  B81B7/02 ,  H01L49/02

CPC分类号： B81B7/007 ,  B81B7/0041 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0136 ,  B81B2203/0315 ,  B81B2207/096 ,  G01P15/125 ,  G01P15/18 ,  H01L23/481 ,  H01L28/40 ,  H01L28/60 ,  H01L28/82 ,  H01L29/84 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus includes a substrate having at least one via disposed in the substrate, wherein the substrate includes a trench having a substantially trapezoidal cross-section, the trench extending through the substrate between a lower surface of the substrate and an upper surface of the substrate, wherein the top of the trench opens to a top opening, and the bottom of the trench opens to a bottom opening, the top opening being larger than the bottom opening. The apparatus can include a mouth surrounding the top opening and extending between the upper surface and the top opening, wherein a mouth opening in the upper surface is larger than the top opening of the trench, wherein the via includes a dielectric layer disposed on an inside surface of a trench. The apparatus includes and a disposed in the trench, with the dielectric layer sandwiched between the fill and the substrate.

公开(公告)号：US09788124B2

公开(公告)日：2017-10-10

申请号：US15244347

申请日：2016-08-23

申请人： Robert Bosch GmbH

发明人： Christoph Schelling ,  Stefan Singer ,  Jochen Zoellin

IPC分类号： H01L29/84 ,  H04R19/00 ,  H04R19/04 ,  B81B7/00

CPC分类号： H04R19/005 ,  B81B7/0041 ,  B81B2201/0257 ,  H01L29/84 ,  H04R19/04 ,  H04R2201/003

摘要： Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a component is implemented in a layer construction on a semiconductor substrate and includes at least one acoustically active diaphragm, which spans a sound hole on the substrate backside, and a stationary acoustically penetrable counterelement having through hole openings, which is situated above/below the diaphragm in the layer construction. At least one outflow channel is developed which makes possible a rapid pressure equalization between the two sides of the diaphragm. In addition, at least one controllable closing element is provided, with which the at least one outflow channel is optionally able to be opened or closed.

公开(公告)号：US09738512B2

公开(公告)日：2017-08-22

申请号：US14603185

申请日：2015-01-22

申请人： InvenSense, Inc.

发明人： Daesung Lee ,  Jongwoo Shin ,  Jong Il Shin ,  Peter Smeys ,  Martin Lim

IPC分类号： H01L23/02 ,  H01L21/54 ,  B81C1/00 ,  B81B7/00 ,  B81B7/02

CPC分类号： B81C1/0023 ,  B81B7/0038 ,  B81B7/0041 ,  B81B7/02 ,  B81B2201/0228 ,  B81B2207/017 ,  B81C1/00285 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0785

摘要： An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two cross-sections a top surface of the outgassing source layer is not covered by the outgassing barrier layer and in the other of the two cross-sections the outgassing source layer is encapsulated in the outgassing barrier layer. The method also includes depositing conformally a second outgassing barrier layer and etching the second outgassing barrier layer such that a spacer of the second outgassing barrier layer is left on sidewalls of the outgassing source layer.

公开(公告)号：US20170233245A1

公开(公告)日：2017-08-17

申请号：US15337701

申请日：2016-10-28

申请人： STMICROELECTRONICS S.R.L.

发明人： Enri DUQI ,  Bruno MURARI ,  Sebastiano CONTI

IPC分类号： B81B7/00 ,  G01L9/00

CPC分类号： B81B7/0041 ,  B81B2201/0264 ,  G01L9/0054 ,  G01L9/0072 ,  G01L15/00 ,  G01L19/0645

摘要： A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

公开(公告)号：US09725304B2

公开(公告)日：2017-08-08

申请号：US14887631

申请日：2015-10-20

申请人： mCube Inc.

发明人： Wenhua Zhang ,  Shingo Yoneoka

IPC分类号： B81B7/02 ,  B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L41/113

CPC分类号： B81B7/02 ,  B81B7/0041 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/0154 ,  H01L21/56 ,  H01L41/1132

摘要： A semiconductor device having multiple MEMS (micro-electro mechanical system) devices includes a semiconductor substrate having a first MEMS device and a second MEMS device, and an encapsulation substrate having a top portion and sidewalls forming a first cavity and a second cavity. The encapsulation substrate is bonded to the semiconductor substrate at the sidewalls to encapsulate the first MEMS device in the first cavity and to encapsulate the second MEMS device in the second cavity. The second cavity includes at least one access channel at a recessed region in a sidewall of the encapsulation substrate adjacent to an interface between the encapsulation substrate and the semiconductor substrate. The access channel is covered by a thin film. The first cavity is at a first atmospheric pressure and the second cavity is at a second atmospheric pressure. The second air pressure is different from the first air pressure.

公开(公告)号：US20170167946A1

公开(公告)日：2017-06-15

申请号：US15258956

申请日：2016-09-07

申请人： InvenSense, Inc.

发明人： Luca Coronato ,  Giacomo Gafforelli ,  Adolfo Giambastiani

IPC分类号： G01M3/26 ,  G01C19/5783 ,  G01C19/5776

CPC分类号： G01M3/26 ,  B81B7/0041 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C99/0045 ,  G01C19/5726 ,  G01C19/5769 ,  G01C19/5776 ,  G01C19/5783 ,  G01P1/023 ,  G01P15/125 ,  G01P15/18

摘要： A microelectromechanical sensor (MEMS) package includes a gyroscope and an accelerometer. The gyroscope is located within a low-pressure cavity that is sealed from an external pressure. The accelerometer is located within a cavity, and the seal for the accelerometer cavity is entirely within the gyroscope cavity. Under normal operating conditions, the accelerometer seal holds the accelerometer cavity at a higher pressure than the pressure of the enclosing gyroscope cavity. In the event that one of the gyroscope seal or the accelerometer seal is broken, the gyroscope senses the change in pressure.

公开(公告)号：US20170107100A1

公开(公告)日：2017-04-20

申请号：US15176365

申请日：2016-06-08

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Shyh-Wei Cheng ,  Chih-Yu Wang ,  Hsi-Cheng Hsu ,  Hsin-Yu Chen ,  Ji-Hong Chiang ,  Jui-Chun Weng ,  Wei-Ding Wu

IPC分类号： B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC分类号： B81B7/0041 ,  B81B3/0081 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/09 ,  B81C1/00293 ,  B81C2201/013 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/037 ,  B81C2203/038 ,  B81C2203/0735 ,  H01L28/20

摘要： The present disclosure relates to a MEMs package having a heating element configured to adjust a pressure within a hermetically sealed chamber by inducing out-gassing of into the chamber, and an associated method. In some embodiments, the MEMs package has a CMOS substrate having one or more semiconductor devices arranged within a semiconductor body. A MEMs structure is connected to the CMOS substrate and has a micro-electromechanical (MEMs) device. The CMOS substrate and the MEMs structure form a hermetically sealed chamber abutting the MEMs device. A heating element is electrically coupled to the one or more semiconductor devices and is separated from the hermetically sealed chamber by an out-gassing layer arranged along an interior surface of the hermetically sealed chamber. By operating the heating element to cause the out-gassing layer to release a gas, the pressure of the hermetically sealed chamber can be adjusted after it is formed.