摘要:
According to an aspect of an embodiment, a method for manufacturing a stamper for duplicating a pit pattern on a substrate includes forming on another substrate, a layer of a material insoluble to a liquid of a suspension of particles in a pattern having a plurality of land portions and a plurality of groove portions between the land portions, and dipping the another substrate having the layer of the material having the pattern in the liquid of the suspension of the particles so that the particles are adhered to the groove portions. The-method further includes forming a mold having a plurality of pits corresponding to the particles by transferring the shapes of the particles on the another substrate to the mold, and forming a stamper having a plurality of protrusions corresponding to the pits by transferring the shapes of the pits of the molds to the stamper.
摘要:
To provide a magnetic recording medium manufacturing method capable of transferring a pattern that can serve as a source for forming anodized alumina-nanoholes with high precision and realizing high productivity, and a large-capacity magnetic recording medium capable of achieving high density recording. The method includes forming a metallic layer on a concavo-convex pattern formed on a surface of a mold; bonding a substrate using an adhesive to a surface of the metallic layer on the side opposite to the mold; separating the mold from the metallic layer; forming, through nanohole formation treatment, a porous layer in which a plurality of nanoholes are formed to orient in a direction substantially perpendicular to a substrate plane by using as a nanohole source a concavo-convex pattern which has been formed by transferring the concavo-convex pattern in the mold to the metallic layer; and charging a magnetic material inside the nanoholes.
摘要:
A method of fabricating a nano structure includes the steps of: forming a particle layer on a substrate that is nano-scale flat by spreading at least one layer of nano-sized particles made of a material different from that of the substrate; forming a holder on the particle layer that holds the particle layer by closely adhering to the particles forming the particle layer; and removing the substrate in a manner that leaves the particle layer intact.
摘要:
According to an aspect of an embodiment, a manufacturing method for a mold includes a step of forming a protection film having fluidity on a front surface of a base material on which concave/convex patterns are partitioned, and a step of punching a mold from the base material by causing a male mold to come into a female mold while overlapping a punching surface of the male mold on a back surface of the base material.
摘要:
A method of manufacturing a molded product includes forming a coat film for covering and concealing particles with the surface of a board while filling the gaps among the particles, and separating the coat film for holding the particles on the reverse side from the board. The coat film and the particles are etched from the reverse side of the separated coat film, the particles are removed from the coat film, and an array of dents carved by the particles is formed on the reverse side of the coat film. A film is formed on the reverse side of the coat film, and a molded product having an array of protrusions on the surface is formed from the film.
摘要:
A method of manufacturing a molded product includes forming a coat film for covering and concealing particles with the surface of a board while filling the gaps among the particles, and separating the coat film for holding the particles on the reverse side from the board. The coat film and the particles are etched from the reverse side of the separated coat film, the particles are removed from the coat film, and an array of dents carved by the particles is formed on the reverse side of the coat film. A film is formed on the reverse side of the coat film, and a molded product having an array of protrusions on the surface is formed from the film.
摘要:
A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.
摘要:
A pad of an embedding tool is received on a faceplate. The pad is supported on a support member. When the embedding tool is urged against the surface of the faceplate, the pad is allowed to change the attitude relative to the support member in response to undulation generated on the surface of the faceplate. The movement of the flat surface follows the undulation of the faceplate. When a relative movement is induced between the embedding tool and the surface of the faceplate, the surface of the faceplate thus reliably receives the uniform or constant contact of the flat surface. When grains are supplied between the flat surface of the pad and the surface of the faceplate, the grains are uniformly pushed into the surface of the faceplate. In this manner, the grains are uniformly and constantly embedded into the surface of the faceplate.
摘要:
An emergency escape veranda apparatus includes a movable veranda member (1) provided so as to form a veranda in a normal state together with a stationary veranda portion (2) projected outside a building. A lowering device (3) makes the movable veranda member (1) descend vertically in an emergency state.
摘要:
An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating.