公开(公告)号：US06895026B2

公开(公告)日：2005-05-17

申请号：US09773509

申请日：2001-02-02

申请人： Hirofumi Miyajima ,  Hirofumi Kan ,  Toshio Naitoh ,  Hirokazu Ohta ,  Takeshi Kanzaki

发明人： Hirofumi Miyajima ,  Hirofumi Kan ,  Toshio Naitoh ,  Hirokazu Ohta ,  Takeshi Kanzaki

IPC分类号： H01L23/473 ,  H05K7/20 ,  H01S3/04

CPC分类号： H01S5/02423 ,  H01L23/473 ,  H01L2924/0002 ,  H01S5/02268 ,  H01S5/4031 ,  H01S5/405 ,  H01L2924/00

摘要： A semiconductor laser stack apparatus 1 comprises three semiconductor lasers 2a to 2c, two copper plates 3a and 3b, two lead plates 4a and 4b, a supply tube 5, a discharge tube 6, four insulating members 7a to 7d, and three heat sinks 10a to 10c. Here, the heat sink 10a to 10c is formed by a lower planar member 12 formed with a supply water path groove portion 22, an intermediate planar member 14 formed with a plurality of water guiding holes 38, and an upper planar member 16 formed with a discharge water path groove portion 30 which are successively stacked one upon another, whereas their contact surfaces are joined together. The heat sink 10a to 10c is provided with pillar pieces 24 for connecting the bottom face of supply water path groove portion 22 and the lower face of intermediate planar member 14 to each other, and pillar pieces 32 for connecting the bottom face of discharge water path groove portion 30 and the upper face of intermediate planar member 14 to each other.

摘要翻译： 半导体激光器堆叠装置1包括三个半导体激光器2a至2c，两个铜板3a和3b，两个引线板4a和4b，供应管5，放电管6，四个绝缘构件7a至 7d，以及三个散热片10a〜10c。 这里，散热器10a〜10c由形成有供水路径槽部22的下平面部件12，形成有多个导水孔38的中间平面部件14和形成有上部平面部件16的下部平面部件12形成 具有相继层叠的排水路径槽部30，而其接触面接合在一起。 散热片10 a至10 c设置有用于将供水路径槽部22的底面和中间平面构件14的下表面彼此连接的支柱24，以及用于连接排出口的底面的支柱32 水通道槽部30和中间平面状部件14的上表面。