High powered laser electronics
    1.
    发明授权

    公开(公告)号:US12051888B2

    公开(公告)日:2024-07-30

    申请号:US18115578

    申请日:2023-02-28

    Abstract: A laser system includes a high voltage AC-to-DC power converter and one or more current sources coupled to the power converter without a DC-to-DC converter between the current sources and the power converter. Each of the current sources includes a high voltage switch and one or more independent safety shutoffs. A laser module is operably coupled to the one or more current source and configured to emit electromagnetic radiation wherein the one or more safety shutoffs are configured to disable emission of electromagnetic radiation from the laser module when triggered. A current source controller coupled to the safety shutoff(s) is configured to generate enabling signals that enable normal current source operation. The controller includes circuitry configured to measure power across the high voltage switch when the controller instructs the high voltage switch to turn off to determine proper operation of the safety shutoff(s).

    Laser pumping device and system including geometric light concentrator and thermal insulator

    公开(公告)号:US11929593B2

    公开(公告)日:2024-03-12

    申请号:US17374975

    申请日:2021-07-13

    Inventor: Yen-Chieh Huang

    CPC classification number: H01S5/4025 H01S3/091 H01S5/02423 H01S5/041

    Abstract: A high-efficiency laser pumping device is provided, wherein a dielectric with or without a tapered aperture is used to accept, guide, and concentrate a pump light toward a laser gain material. Preferably, the dielectric is also a heat insulator between the pump-light source and the laser gain material. The pump-light source includes an array of light-emitting diodes, or an array of laser diodes, or an array of mixed light-emitting-diodes and laser diodes. Preferably, the input and output faces of the dielectric are optically coated with dielectric layers to maximize the pump brightness toward the laser gain material. A high-efficiency laser-pumping system with active cooling apparatus is further provided, wherein a plural number of the optical-guiding and thermal-insulation dielectrics are arranged to receive the pump lights from a plural number of pump-light sources, configured to concentrate all the pump light toward a laser gain material.

    SUBSTRATE HEAT-TREATING APPARATUS USING VCSEL

    公开(公告)号:US20230274955A1

    公开(公告)日:2023-08-31

    申请号:US18008103

    申请日:2020-09-23

    CPC classification number: H01L21/67115 H01S5/423 H01L21/68764 H01S5/02423

    Abstract: The present disclosure discloses a substrate heat-treatment apparatus using a VCSEL element, the substrate heat-treatment apparatus comprising: a process chamber in which a flat plate substrate to be heat-treated is mounted; and an irradiation module for irradiating a laser beam onto the flat plate substrate, the irradiation module including a sub-irradiation module which includes an element array plate, an element area which is mounted on an upper surface of the element array plate and on which the VCSEL element is mounted, and a terminal area on which an electrode terminal is mounted and which is located at the front or rear side of the element area, wherein, in the irradiation module, the element area and the terminal area are respectively arranged in the x-axis direction, and the element area and the terminal area are alternately arranged along the y-axis direction perpendicular to the x-axis direction.

    SEMICONDUCTOR LASER MODULE
    5.
    发明公开

    公开(公告)号:US20230253757A1

    公开(公告)日:2023-08-10

    申请号:US18003111

    申请日:2021-08-03

    Inventor: Daisuke MORITA

    CPC classification number: H01S5/02423 H01S5/023 H01S5/04256 H01S5/02469

    Abstract: A semiconductor laser module includes: a semiconductor laser element that outputs a laser beam; a sub-mount material that is electrically conductive and bonded to a first surface of the semiconductor laser element; an electrode assembly that is electrically conductive and connected to a second surface of the semiconductor laser element; a conductive wire structure including a plurality of linear members interconnecting the electrode assembly and the second surface; an insulating plate bonded to the electrode assembly; and a cooling block bonded to the sub-mount material and the insulating plate for cooling the semiconductor laser element, wherein the conductive wire structure fixed to the electrode assembly is electrically connected to the semiconductor laser element after the semiconductor laser element, the sub-mount material, and the cooling block are fixed together through bonding materials.

    LASER OSCILLATOR
    7.
    发明申请
    LASER OSCILLATOR 审中-公开

    公开(公告)号:US20190109429A1

    公开(公告)日:2019-04-11

    申请号:US16132572

    申请日:2018-09-17

    Inventor: Michinori MAEDA

    Abstract: A laser oscillator having a condensation prevention mechanism capable of extending the life span of a light emitting device while maintaining cost effectiveness as compared to the conventional technique is provided. The laser oscillator includes: a laser beam generating unit; a heat exchanger; a coolant bypass circuit; a coolant circuit connecting these components; a housing storing these components; a coolant circulating unit that circulates a coolant to the laser beam generating unit, the heat exchanger, and the coolant bypass circuit with the aid of the coolant circuit; a first valve that adjusts a flow rate of the coolant supplied to the laser beam generating unit; a second valve that adjusts a flow rate of the coolant supplied to the heat exchanger; a third valve that adjusts the flow rate of the coolant supplied to the coolant bypass circuit; a dew point measuring unit that measures a dew point inside the housing; a temperature measuring unit that measures a coolant temperature; and a control unit that controls the first, second, and third valves on the basis of the dew point and the coolant temperature.

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