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公开(公告)号:US12051888B2
公开(公告)日:2024-07-30
申请号:US18115578
申请日:2023-02-28
Applicant: IPG Photonics Corporation
Inventor: Adam Pinard , Wolf Fuchs , Keith Millea , Oleg Shkurikhin
CPC classification number: H01S5/4025 , H01S5/02423 , H01S5/042 , H01S5/06808 , H01S5/022 , H01S5/02438
Abstract: A laser system includes a high voltage AC-to-DC power converter and one or more current sources coupled to the power converter without a DC-to-DC converter between the current sources and the power converter. Each of the current sources includes a high voltage switch and one or more independent safety shutoffs. A laser module is operably coupled to the one or more current source and configured to emit electromagnetic radiation wherein the one or more safety shutoffs are configured to disable emission of electromagnetic radiation from the laser module when triggered. A current source controller coupled to the safety shutoff(s) is configured to generate enabling signals that enable normal current source operation. The controller includes circuitry configured to measure power across the high voltage switch when the controller instructs the high voltage switch to turn off to determine proper operation of the safety shutoff(s).
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公开(公告)号:US11929593B2
公开(公告)日:2024-03-12
申请号:US17374975
申请日:2021-07-13
Applicant: NATIONAL TSING HUA UNIVERSITY
Inventor: Yen-Chieh Huang
CPC classification number: H01S5/4025 , H01S3/091 , H01S5/02423 , H01S5/041
Abstract: A high-efficiency laser pumping device is provided, wherein a dielectric with or without a tapered aperture is used to accept, guide, and concentrate a pump light toward a laser gain material. Preferably, the dielectric is also a heat insulator between the pump-light source and the laser gain material. The pump-light source includes an array of light-emitting diodes, or an array of laser diodes, or an array of mixed light-emitting-diodes and laser diodes. Preferably, the input and output faces of the dielectric are optically coated with dielectric layers to maximize the pump brightness toward the laser gain material. A high-efficiency laser-pumping system with active cooling apparatus is further provided, wherein a plural number of the optical-guiding and thermal-insulation dielectrics are arranged to receive the pump lights from a plural number of pump-light sources, configured to concentrate all the pump light toward a laser gain material.
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公开(公告)号:US11848534B2
公开(公告)日:2023-12-19
申请号:US15529371
申请日:2015-11-24
Applicant: Evolve Additive Solutions, Inc.
Inventor: J. Samuel Batchelder , Moshe Aknin , Jonathan B. Hedlund
IPC: H01S5/024 , B33Y30/00 , B33Y10/00 , B29C64/386 , B29C64/268 , B29C64/393 , H01S5/00 , H01S5/40 , H01S5/02 , B29C64/135 , H01S5/02325 , B33Y50/02 , H01S5/042 , H01S5/02212 , B29K105/24
CPC classification number: H01S5/02469 , B29C64/135 , B29C64/268 , B29C64/386 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , H01S5/005 , H01S5/02 , H01S5/02325 , H01S5/02423 , H01S5/042 , H01S5/405 , H01S5/4025 , B29K2105/24 , H01L2224/48091 , H01S5/02212 , H01L2224/48091 , H01L2924/00014
Abstract: A laser assembly for use with an additive manufacturing system, which includes a base block configured to be moved along a scan direction axis in the additive manufacturing system, a plurality of laser emitters preferably arranged in an array of at least two rows of two or more laser emitters. At least a portion of a heat sink assembly is configured to draw heat away from the base block and/or the laser emitters. The assembly includes a controller assembly a controller assembly configured to control a movement of the base block along the first axis and to independently control at least timing and duration of energy emitted from each laser emitter of the plurality of laser emitters as the base block moves along the first axis.
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公开(公告)号:US20230274955A1
公开(公告)日:2023-08-31
申请号:US18008103
申请日:2020-09-23
Applicant: Viatron Co., Ltd.
Inventor: Hyoung June Kim , Byung Kuk Kim , Wang Jun Park , Tae Hyeong Kim , Bo Ram Lee
IPC: H01L21/67 , H01S5/42 , H01L21/687 , H01S5/024
CPC classification number: H01L21/67115 , H01S5/423 , H01L21/68764 , H01S5/02423
Abstract: The present disclosure discloses a substrate heat-treatment apparatus using a VCSEL element, the substrate heat-treatment apparatus comprising: a process chamber in which a flat plate substrate to be heat-treated is mounted; and an irradiation module for irradiating a laser beam onto the flat plate substrate, the irradiation module including a sub-irradiation module which includes an element array plate, an element area which is mounted on an upper surface of the element array plate and on which the VCSEL element is mounted, and a terminal area on which an electrode terminal is mounted and which is located at the front or rear side of the element area, wherein, in the irradiation module, the element area and the terminal area are respectively arranged in the x-axis direction, and the element area and the terminal area are alternately arranged along the y-axis direction perpendicular to the x-axis direction.
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公开(公告)号:US20230253757A1
公开(公告)日:2023-08-10
申请号:US18003111
申请日:2021-08-03
Applicant: Mitsubishi Electric Corporation
Inventor: Daisuke MORITA
CPC classification number: H01S5/02423 , H01S5/023 , H01S5/04256 , H01S5/02469
Abstract: A semiconductor laser module includes: a semiconductor laser element that outputs a laser beam; a sub-mount material that is electrically conductive and bonded to a first surface of the semiconductor laser element; an electrode assembly that is electrically conductive and connected to a second surface of the semiconductor laser element; a conductive wire structure including a plurality of linear members interconnecting the electrode assembly and the second surface; an insulating plate bonded to the electrode assembly; and a cooling block bonded to the sub-mount material and the insulating plate for cooling the semiconductor laser element, wherein the conductive wire structure fixed to the electrode assembly is electrically connected to the semiconductor laser element after the semiconductor laser element, the sub-mount material, and the cooling block are fixed together through bonding materials.
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公开(公告)号:US20190207357A1
公开(公告)日:2019-07-04
申请号:US16299047
申请日:2019-03-11
Inventor: Siyang Cheng , Peijin Wang , Xiaoyu Wang , Qian Cheng
IPC: H01S3/042 , H01S5/024 , H01S5/022 , H01S5/40 , F21V5/04 , H01S3/02 , H01S3/04 , H01S3/0941 , F21V29/503 , F21V29/504 , F21V29/508 , F21V29/56
CPC classification number: H01S3/042 , F21V5/04 , F21V29/503 , F21V29/504 , F21V29/508 , F21V29/56 , F21Y2105/10 , F21Y2115/30 , H01S3/025 , H01S3/0405 , H01S3/0407 , H01S3/0606 , H01S3/07 , H01S3/09415 , H01S3/109 , H01S5/02 , H01S5/02212 , H01S5/02236 , H01S5/02248 , H01S5/02415 , H01S5/02423 , H01S5/02438 , H01S5/02469 , H01S5/4025
Abstract: A system includes: a heat sink module with a plurality of first through-holes linking its top and bottom surfaces and a plurality of grooves on the bottom surface, wherein each groove passes through a respective sequence of the first through-holes; and a driving circuit module with a plurality of conductive connectors and electrical driving surfaces that are disposed substantially perpendicular to the top and bottom surfaces of the heat sink module, wherein each conductive connector lies partially within a respective groove in the bottom surface of the heat sink module, the conductive connectors include internal connectors that each links at least two of the first through-holes in a respective sequence of first through-holes, and external connectors that each links at least one of the first through-holes in a respective sequence of first through-holes to an electrical driving surfaces of the driving circuit module.
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公开(公告)号:US20190109429A1
公开(公告)日:2019-04-11
申请号:US16132572
申请日:2018-09-17
Applicant: FANUC CORPORATION
Inventor: Michinori MAEDA
CPC classification number: H01S3/042 , H01S3/0014 , H01S3/025 , H01S3/027 , H01S3/0407 , H01S3/1028 , H01S5/0014 , H01S5/02423 , H01S5/02453
Abstract: A laser oscillator having a condensation prevention mechanism capable of extending the life span of a light emitting device while maintaining cost effectiveness as compared to the conventional technique is provided. The laser oscillator includes: a laser beam generating unit; a heat exchanger; a coolant bypass circuit; a coolant circuit connecting these components; a housing storing these components; a coolant circulating unit that circulates a coolant to the laser beam generating unit, the heat exchanger, and the coolant bypass circuit with the aid of the coolant circuit; a first valve that adjusts a flow rate of the coolant supplied to the laser beam generating unit; a second valve that adjusts a flow rate of the coolant supplied to the heat exchanger; a third valve that adjusts the flow rate of the coolant supplied to the coolant bypass circuit; a dew point measuring unit that measures a dew point inside the housing; a temperature measuring unit that measures a coolant temperature; and a control unit that controls the first, second, and third valves on the basis of the dew point and the coolant temperature.
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公开(公告)号:US20190044305A1
公开(公告)日:2019-02-07
申请号:US16068170
申请日:2016-03-08
Applicant: MITSUBISHI ELECTRIC CORPORATION
Inventor: Makoto KURIAKI
IPC: H01S5/068 , H01S5/40 , H01S5/042 , H01S5/0683
CPC classification number: H01S5/06825 , H01S5/02415 , H01S5/02423 , H01S5/042 , H01S5/0617 , H01S5/06804 , H01S5/0683 , H01S5/4018 , H01S5/4025
Abstract: An object is to provide a technology capable of suppressing life deterioration of a laser light source device. A laser light source device includes a laser bank having a plurality of semiconductor laser elements, a drive part for applying an electric current to the plurality of semiconductor laser elements of the laser bank, a light intensity detection part for detecting light intensity output from the laser bank, a temperature detection part for detecting a temperature of the laser bank, and a control part for determining an electric current limit value based on the detected temperature, and for controlling the electric current of the drive part based on the detected light intensity and the electric current limit value.
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公开(公告)号:US20180309264A1
公开(公告)日:2018-10-25
申请号:US15961750
申请日:2018-04-24
Applicant: Manoj Kanskar , Mark DeFranza
Inventor: Manoj Kanskar , Mark DeFranza
CPC classification number: H01S5/02423 , H01S5/005 , H01S5/0071 , H01S5/02216 , H01S5/02252 , H01S5/02284 , H01S5/02469 , H01S5/02492 , H01S5/4012 , H01S5/4056
Abstract: Apparatus include a conductive block including a base surface and a plurality of parallel stepped surfaces opposite the base surface and defining respective mounting surfaces situated to receive respective laser diodes having respective thermal paths defining a common thermal path distance from the mounting surfaces to the base surface, and a two-phase cooling unit including a coupling surface attached to the base surface of the conductive block and wherein the two-phase cooling unit is situated to conduct heat generated through the emission of laser beams from the laser diodes along the thermal paths.
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公开(公告)号:US10007077B2
公开(公告)日:2018-06-26
申请号:US14440378
申请日:2014-08-21
Inventor: Benjamin R. Johnson
CPC classification number: G02B6/44 , H01S3/0401 , H01S3/0404 , H01S3/0407 , H01S3/042 , H01S3/06704 , H01S3/0675 , H01S3/094003 , H01S3/09415 , H01S5/02423 , H01S5/0243
Abstract: A system provides for a way for cooling an optical fiber. The system includes a coolant and a conduit. The conduit allows the coolant to flow through the conduit. At least part of the fiber passes through the conduit allowing the coolant to flow around the at least part of the fiber. In some configurations, the fiber runs parallel to the conduit. The system can include a pump diode that is part of an optical laser connected to an end of the fiber. The optical laser can further include a high reflector connected to the fiber and a partial reflector connected to the fiber to reflect some light back and forth between the high reflector and the partial reflector.
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