摘要:
This invention provides water-absorbing polymer particles suitable particularly for cosmetics, wherein silicone can be stably present on the surface of a water-absorbing polymer even in various formulations thereby giving dry feeling in use even after water absorption. The silicone-modified water-absorbing polymer particles of this invention comprises water-absorbing polymer particles coated thereon via chemical bonding, with a silicone compound having at least one functional group.
摘要:
An absorbent article includes a liquid permeable topsheet, a liquid impermeable back sheet, and an absorbent member interposed between the topsheet and the back sheet. While worn, the absorbent article forms a front waist body portion located at the front waist of a wearer and a rear waist body portion located at the rear waist of a wearer. The rear waist body portion has at each side thereof a fastening member for fastening the absorbent article, wherein the back sheet is made up of laminated sheeting composed of a finely porous resin film and nonwoven fabric. The fastening member is formed of a male sheet member of a mechanical fastener and designed to be brought into direct contact with the surface of the nonwoven fabric constituting the back sheet. The above-mentioned absorbent article has a good fit on a wearer, exhibits excellent leakproofness and breathability while worn, and has an excellent texture.
摘要:
The porous sheet obtainable by stretching, in at least one direction, a sheet formed from a melt mixture of a resin composition comprising: 100 parts by weight of a resin mixture consisting of 63 to 90 parts by weight of a crystalline polyolefin resin, and 37 to 10 parts by weight of a compound having a volatile temperature at an ambient pressure of 240.degree. C. or higher and a melting temperature of 90.degree. C. or lower; and 7 to 40 parts by weight of a particulate material having an average particle diameter of 0.3 to 8 .mu.m and a maximum particle diameter of 13 .mu.m or smaller, the particulate material being not melted at the molding temperature of the resin mixture is disclosed.