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公开(公告)号:US06796761B2
公开(公告)日:2004-09-28
申请号:US10253040
申请日:2002-09-24
IPC分类号: F16B2500
CPC分类号: F16B35/047 , F16B37/00
摘要: A bolt is provided with a head part and a shank part. The shank part includes a first constant diameter cylindrical part, a transition part, a cylindrical connection part, and a second constant diameter cylindrical part concentrically extending from the first constant diameter cylindrical part to the second constant diameter cylindrical part. The first constant diameter cylindrical part has a screw thread with a predetermined pitch formed on the side surface thereof. The transition part has a tapered shape and has a screw thread with a predetermined pitch formed on the side surface thereof. The cylindrical connection part has a diameter smaller than that of the first constant diameter part. The second constant diameter cylindrical part has a diameter smaller than the first constant diameter part, and has a screw thread with a predetermined pitch formed on the side surface thereof. The crest part of the screw thread formed on the side surface of the transition part is truncated.
摘要翻译: 螺栓设置有头部和柄部。 柄部分包括第一恒定直径圆柱形部分,过渡部分,圆柱形连接部分和从第一恒定直径圆柱形部分同心地延伸到第二恒定直径圆柱形部分的第二恒定直径圆柱形部分。 第一恒定直径的圆柱形部分具有形成在其侧表面上的预定间距的螺纹。 过渡部分具有锥形形状并且具有形成在其侧表面上的预定间距的螺纹。 圆筒形连接部分的直径小于第一恒定直径部分的直径。 第二恒定直径的圆筒部的直径小于第一恒定直径部,并且在其侧面形成有规定间距的螺纹。 形成在过渡部分的侧表面上的螺纹的顶部被截断。
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公开(公告)号:US5387118A
公开(公告)日:1995-02-07
申请号:US103756
申请日:1993-08-10
申请人: Nobuaki Kishi , Makoto Hoshi , Tetsuya Osawa , Ichiro Matsuo
发明人: Nobuaki Kishi , Makoto Hoshi , Tetsuya Osawa , Ichiro Matsuo
CPC分类号: H05K7/1023
摘要: A socket for an IC package includes a base member having a receptacle space for the IC package, a plurality of contacts arranged in parallel along the sides of the receptacle space of the base member. The contacts each have a contact portion for contact with a corresponding lead of the IC package received in the receptacle space. A spring portion urges the contact portion inwardly to obtain a contact pressure against a lead. A connecting shaft is pivotally supported vertically along each row of the contacts, and is associated with the contacts. A cover covers the base member, and the connecting shaft pivots by depression of the cover to displace the contact portion of each contact outwardly away from the corresponding lead of the IC package against a biasing force of the spring portion. The contact has a curved, first spring portion extending upwardly and inwardly from an inside edge of a plate portion. A second spring portion is bent inwardly from a front end of the first spring portion and is contiguous to the contact portion, and a projection is formed on an upper surface of the second spring portion. The connecting portion has an engaging recess for engagement with the projection and also has an engaging face for engagement with the portion behind the projection. The cover includes inclined surface for allowing the movable cams to move pivotally outwardly.
摘要翻译: 用于IC封装的插座包括具有用于IC封装的插座空间的基座构件,沿着基座构件的容置空间的侧面平行布置的多个触点。 触点各具有用于与容纳空间中容纳的IC封装的相应导线接触的接触部分。 弹簧部分向内推动接触部分以获得针对引线的接触压力。 连接轴沿着每一排触点垂直地枢转地支撑,并且与触点相关联。 盖子覆盖基座构件,并且连接轴通过按压盖枢转,以抵抗弹簧部分的偏压力将每个触头的接触部分从外部远离IC封装的引线移开。 接触件具有从板部分的内边缘向上和向内延伸的弯曲的第一弹簧部分。 第二弹簧部分从第一弹簧部分的前端向内弯曲并且与接触部分邻接,并且突起形成在第二弹簧部分的上表面上。 连接部分具有用于与突起接合的接合凹槽,并且还具有用于与突出部分后面的部分接合的接合面。 该盖包括用于允许可动凸轮向外转动的倾斜表面。
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公开(公告)号:US07132607B2
公开(公告)日:2006-11-07
申请号:US10860491
申请日:2004-06-04
申请人: Takeshi Yoshimi , Tetsuya Osawa
发明人: Takeshi Yoshimi , Tetsuya Osawa
IPC分类号: H05K1/03
CPC分类号: H05K1/0218 , H05K1/056 , H05K3/4644 , H05K2201/09554
摘要: A wired circuit board is provided having enhanced reliability of electrical connection between a metal substrate and a shield layer to achieve significant noise reduction reliably. An insulating base layer is formed on the metal substrate, while resin layers are formed on the metal substrate with a predetermined space provided from the both widthwise sides of the insulating base layer. A conductor layer is formed having a predetermined wired circuit pattern on the insulating base layer. Thereafter, an insulating cover layer is formed on the insulating base layer in such a manner as to cover the conductor layer. Then, a shield layer is laminated on the metal substrate to cover the insulating cover layer and also is put in close contact with the resin layers at end portions thereof by a vacuum film-forming method or by plating.
摘要翻译: 提供了一种布线电路板,其具有在金属基板和屏蔽层之间具有增强的电连接的可靠性,以可靠地实现显着的降噪。 在金属基板上形成绝缘基层,同时在金属基板上形成有从基底绝缘层的宽度方向两侧设置的预定空间的树脂层。 在绝缘基底层上形成具有预定布线电路图案的导体层。 此后,以覆盖导体层的方式在绝缘基底层上形成绝缘覆盖层。 然后,在金属基板上层压屏蔽层以覆盖绝缘覆盖层,并且还通过真空成膜方法或通过电镀在其端部与树脂层紧密接触。
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