公开(公告)号：US06956879B2

公开(公告)日：2005-10-18

申请号：US10290294

申请日：2002-11-08

申请人： Hideaki Tatsuta ,  Hiroshi Chikugawa ,  Takaaki Horio ,  Shinji Yudate

发明人： Hideaki Tatsuta ,  Hiroshi Chikugawa ,  Takaaki Horio ,  Shinji Yudate

IPC分类号： G11B7/08 ,  G11B7/125 ,  G11B7/22 ,  H01L21/00 ,  H01L21/52 ,  H01S5/02 ,  H01S5/022 ,  H01S5/40 ,  H01S3/04

CPC分类号： H01L21/67259 ,  H01L21/67138 ,  H01S5/02212 ,  H01S5/02252 ,  H01S5/4031 ,  H01S5/4056 ,  Y10T29/41

摘要： The present invention relates to an optical pickup used for an optical recording information instrument such as CD-ROM, CD-R, MO, DVD and the like, and a semiconductor laser device assembled to be incorporated in the optical pickup, as well as to a method for manufacturing said semiconductor laser device. The present invention also relates to a semiconductor laser element comprising a plurality of semiconductor laser chips, which is incorporated in the semiconductor laser device and to a method for manufacturing said semiconductor laser element, especially to an apparatus for accurately bonding and assembling a semiconductor laser element used in manufacturing said semiconductor laser element, such as a semiconductor laser chip die-bonding machine and the like.

公开(公告)号：US20050026319A1

公开(公告)日：2005-02-03

申请号：US10928137

申请日：2004-08-30

申请人： Hiroshi Chikugawa ,  Shinji Yudate

发明人： Hiroshi Chikugawa ,  Shinji Yudate

IPC分类号： G11B7/08 ,  G11B7/125 ,  G11B7/22 ,  H01L21/00 ,  H01L21/52 ,  H01S5/02 ,  H01S5/022 ,  H01S5/40 ,  H01S5/00

CPC分类号： H01L21/67259 ,  H01L21/67138 ,  H01S5/02212 ,  H01S5/02252 ,  H01S5/4031 ,  H01S5/4056

摘要： The present invention relates to an optical pickup used for an optical recording information instrument such as CD-ROM, CD-R, MO, DVD and the like, and a semiconductor laser device assembled to be incorporated in the optical pickup, as well as to a method for manufacturing said semiconductor laser device. The present invention also relates to a semiconductor laser element comprising a plurality of semiconductor laser chips, which is incorporated in the semiconductor laser device and to a method for manufacturing said semiconductor laser element, especially to an apparatus for accurately bonding and assembling a semiconductor laser element used in manufacturing said semiconductor laser element, such as a semiconductor laser chip die-bonding machine and the like.

摘要翻译： 本发明涉及一种用于诸如CD-ROM，CD-R，MO，DVD等的光学记录信息仪器的光学拾取器，以及组装成并入光学拾取器中的半导体激光器件，以及 一种制造所述半导体激光器件的方法。 本发明还涉及一种包括多个半导体激光器芯片的半导体激光器元件，其结合在半导体激光器件中以及用于制造所述半导体激光器元件的方法，特别涉及用于精确地结合和组装半导体激光元件的设备 用于制造所述半导体激光元件，例如半导体激光芯片芯片接合机等。