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    ELECTRODE SUBSTRATE AND PHOTOELECTRIC CONVERSION ELEMENT
    1.
    发明申请
    ELECTRODE SUBSTRATE AND PHOTOELECTRIC CONVERSION ELEMENT 审中-公开
    电极基板和光电转换元件

    公开(公告)号：US20080169022A1

    公开(公告)日：2008-07-17

    申请号：US12024727

    申请日：2008-02-01

    申请人： Hiroshi MATSUI ,  Kenichi OKADA ,  Tetsuya EZURE ,  Nobuo TANABE

    发明人： Hiroshi MATSUI ,  Kenichi OKADA ,  Tetsuya EZURE ,  Nobuo TANABE

    IPC分类号： H01L31/0224

    CPC分类号： H01L31/022425 ,  H01G9/2031 ,  H01G9/2068 ,  H01L31/022466 ,  H01L31/022475 ,  Y02E10/542

    摘要： To provide an electrode substrate 1 that has a transparent conductive layer 11, a current-collecting metal layer 12 that is provided on the transparent conductive layer 11, and an insulating layer 14 that covers the current-collecting metal layer 12 on a base plate, wherein, when a thermal expansion coefficient of the base plate 10 is defined as α, and a thermal expansion coefficient of the insulating layer 14 is defined as β, α>β is satisfied, and in which the thickness of the transparent conductive layer 11 is 0.05 to 5 μm. The electrode substrate 1 can lower the resistance of the electrode substrate 1. Moreover, it is possible to provide an electrode substrate that can suppress degradation of the characteristics due to leak current from the metal wiring to the electrolyte solution and corrosion of the current-collecting metal layer and a photoelectric conversion element that is suitably used in a solar battery.

    摘要翻译： 为了提供具有透明导电层11的电极基板1，设置在透明导电层11上的集电金属层12和覆盖基板上的集电金属层12的绝缘层14， 其中，当将基板10的热膨胀系数定义为α，并且将绝缘层14的热膨胀系数定义为β时，满足α>β，并且其中透明导电层11的厚度为 0.05〜5um。 电极基板1可以降低电极基板1的电阻。此外，可以提供能够抑制由于从金属布线到电解液的漏电流引起的特性劣化的电极基板和集电体的集电 金属层和适用于太阳能电池的光电转换元件。

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
    4.
    发明申请
    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR 失效
    电子设备及其制造方法

    公开(公告)号：US20070249088A1

    公开(公告)日：2007-10-25

    申请号：US11768399

    申请日：2007-06-26

    申请人： Kiwako OHMORI ,  Nobuo TANABE ,  Akinobu ONO

    发明人： Kiwako OHMORI ,  Nobuo TANABE ,  Akinobu ONO

    IPC分类号： H01L51/40

    CPC分类号： H01L51/0015 ,  G03F7/039 ,  G03F7/093 ,  H01L51/5206

    摘要： A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.

    摘要翻译： 一种电子器件的制造方法，该方法包括在基材上形成包含导电聚合物的透明导电膜，并将紫外光照射到透明导电膜的一部分上，使得透明导电膜的第一区域不被照射 并且与第一区域相邻的第二区域被照射，从而形成照射部分和未照射部分。 所述照射部的电阻值高于未照射部的电阻值。 紫外线包括透明导电膜的导电性聚合物的吸收光谱中的吸光度的波长比背景的两倍以上。

    PHOTOELECTRIC CONVERSION ELEMENT
    6.
    发明申请
    PHOTOELECTRIC CONVERSION ELEMENT 有权
    光电转换元件

    公开(公告)号：US20110073170A1

    公开(公告)日：2011-03-31

    申请号：US12960228

    申请日：2010-12-03

    申请人： Takeshi KIZAKI ,  Nobuo TANABE ,  Takayuki KITAMURA

    发明人： Takeshi KIZAKI ,  Nobuo TANABE ,  Takayuki KITAMURA

    IPC分类号： H01L31/02 ,  H01L51/44

    CPC分类号： H01G9/2027 ,  H01G9/2059 ,  H01G9/2068 ,  H01G9/2086 ,  Y02E10/542

    摘要： A photoelectric conversion element of the present invention includes: a first electrode being linear; a second electrode; and an electrolyte. The first electrode and the second electrode are disposed via the electrolyte. The first electrode includes a first linear material which includes a copper wire and a metal coating which coats the copper wire and a dye-carrying porous oxide semiconductor layer disposed on an outer circumference of the first linear material.

    摘要翻译： 本发明的光电转换元件包括：第一电极是线性的; 第二电极; 和电解质。 第一电极和第二电极经由电解质配置。 第一电极包括第一线性材料，其包括铜线和涂覆铜线的金属涂层和设置在第一线性材料的外圆周上的染料负载多孔氧化物半导体层。