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公开(公告)号：USD419536S
公开(公告)日：2000-01-25
申请号：US98542
申请日：1998-12-30
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公开(公告)号：US5023695A
公开(公告)日：1991-06-11
申请号：US349411
申请日：1989-05-08
申请人： Kazuhiko Umezawa , Toshiaki Komatsu , Jun Kubokawa
发明人： Kazuhiko Umezawa , Toshiaki Komatsu , Jun Kubokawa
IPC分类号： H01L23/473
CPC分类号： H01L23/4735 , H01L2224/16
摘要： A circuit assembly with circulation of coolant. A plurality of chips of integrated circuit are arranged on a substrate separately from each other in rows and columns. A circulating unit disposed on the substrate and having a planar shape circulates coolant therethrough. The circulating unit has within its bottom side a plurality of cells arranged in rows and columns correspondingly to the plurality of chips. Each individual cell is thermally connected to the corresponding individual chip so as to receive therefrom heat generated thereby. The circulating unit includes a distributor for distributing to the respective cells the circulated coolant effective to absorb the heat received in the respective cells.
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公开(公告)号：USD456402S1
公开(公告)日：2002-04-30
申请号：US29138302
申请日：2001-03-12
申请人： Hideo Sue , Toshiaki Komatsu , Jun Kubokawa , Junya Ohno , Muneyoshi Nikuni
设计人： Hideo Sue , Toshiaki Komatsu , Jun Kubokawa , Junya Ohno , Muneyoshi Nikuni
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公开(公告)号：USD484502S1
公开(公告)日：2003-12-30
申请号：US29173136
申请日：2002-12-24
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公开(公告)号：USD484501S1
公开(公告)日：2003-12-30
申请号：US29173135
申请日：2002-12-24
申请人： Kazuhiko Umezawa , Jun Kubokawa , Youichi Higuchi , Yoshin Segawa
设计人： Kazuhiko Umezawa , Jun Kubokawa , Youichi Higuchi , Yoshin Segawa
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公开(公告)号：USD484877S1
公开(公告)日：2004-01-06
申请号：US29173129
申请日：2002-12-24
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