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1.发明申请Liquid Resin Composition for Electronic Components and Electronic Component Device 有权电子元件和电子元器件液体树脂组合物公开(公告)号：US20090286930A1
公开(公告)日：2009-11-19
申请号：US12094838
申请日：2006-11-24
CPC分类号： C08G59/42 , C08L63/00 , H01L23/295 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.
摘要翻译： 本发明提供一种电迁移阻力优异，成型性和可靠性优异的电子部件用液态树脂组合物及其密封的电子部件装置，其涉及电子部件用液态树脂组合物， A）环氧树脂，（B）在常温下为液体并且酸酐当量为200以上的环状酸酐，（C）偶联剂。
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2.发明授权Liquid resin composition for electronic components and electronic component device 有权液体树脂组合物用于电子部件和电子部件装置公开(公告)号：US08232355B2
公开(公告)日：2012-07-31
申请号：US12094838
申请日：2006-11-24
IPC分类号： C08F283/12 , C08F283/10 , C08G77/38 , C08G77/04 , C08L63/00 , C08L83/02
CPC分类号： C08G59/42 , C08L63/00 , H01L23/295 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.
摘要翻译： 本发明提供一种电迁移阻力优异，成型性和可靠性优异的电子部件用液态树脂组合物及其密封的电子部件装置，其涉及电子部件用液态树脂组合物， A）环氧树脂，（B）在常温下为液体并且酸酐当量为200以上的环状酸酐，（C）偶联剂。
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