Enameled wire
    1.
    发明授权
    Enameled wire 有权
    漆包线

    公开(公告)号:US06906258B2

    公开(公告)日:2005-06-14

    申请号:US10619522

    申请日:2003-07-16

    CPC分类号: H01B3/421 H01B3/305 H01B3/446

    摘要: An enameled wire capable of improving withstand lifetime with respect to the application of surge voltage of an inverter and thermal degradation thereof while restricting an amount of an inorganic filler material is provided. The enameled wire includes an electrically conductive wire (11) and a coating (12) formed of a high molecular compound uniformly mixed with an inorganic filler material in the form of fine flat particles provided around the electrically conductive wire (11). The enameled wire may include an electrically conductive wire (21), a coating (23) formed of a polyester imide resin solution mixed with an inorganic filler material in the form of fine flat particles and provided on the conductive wire and a coating (24) formed of polyamide imide and provided on the coating (23).

    摘要翻译: 提供一种能够在限制一定量的无机填充材料的同时提高耐逆变器的浪涌电压的耐久寿命及其热劣化的漆包线。 漆包线包括导电线(11)和由设置在导电线(11)周围的细平坦颗粒形式的无机填料材料均匀混合的高分子化合物形成的涂层(12)。 漆包线可以包括导电线(21),由聚酰亚胺树脂溶液形成的涂层(23),该聚酯酰亚胺树脂溶液与细平坦颗粒形式的无机填料混合并设置在导线上,涂层(24) 由聚酰胺酰亚胺形成并提供在涂层(23)上。

    Epoxy resin composition for encapsulation of semi-conductor device
    2.
    发明授权
    Epoxy resin composition for encapsulation of semi-conductor device 失效
    用于半导体器件封装的环氧树脂组合物

    公开(公告)号:US4719255A

    公开(公告)日:1988-01-12

    申请号:US760770

    申请日:1985-07-31

    IPC分类号: C08L63/00 H01B3/40

    CPC分类号: H01B3/40 C08L63/00

    摘要: An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.

    摘要翻译: 用于半导体器件封装的环氧树脂组合物包括如下所示的组分(a),(b),(c)和组分(d)和(e)中的至少一种:(a)100重量份的 一个分子中具有至少2个环氧基团的环氧树脂; (b)8〜65重量份邻位比小于50%的酚醛清漆型酚醛树脂; (c)1.2〜40重量份的聚乙烯醇缩醛化合物; (d)0.8〜30重量份的硅油; 和(e)4至80重量份的橡胶改性酚醛树脂。 所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度,并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。

    Method of manufacturing insulated coil of rotating electric machine and insulated coil
    3.
    发明申请
    Method of manufacturing insulated coil of rotating electric machine and insulated coil 审中-公开
    制造旋转电机和绝缘线圈绝缘线圈的方法

    公开(公告)号:US20050104252A1

    公开(公告)日:2005-05-19

    申请号:US10501928

    申请日:2003-01-30

    CPC分类号: H02K15/12

    摘要: An insulated coil for electric rotating machinery, according to the present invention is manufactured based on a method of manufacturing the insulated coil for an electric rotating machinery, which includes the steps of taping a mica tape on a coil conductor to mold an insulating layer, impregnating the coil with resin under vacuum and pressure condition, attaching a molding jig on the coil impregnated with the resin, and then heating the resin with which the coil is impregnated, to cure the resin, thus manufacturing the insulated coil. The mica tape taping step, a heat-shrinkable tape taping step, the impregnating step under vacuum and pressure, the resin heating/curing step utilizing a liquid heating compound and a molding jig-disassembling/finishing step are carried out to manufacture the insulated coil.

    摘要翻译: 根据本发明的用于电动旋转机械的绝缘线圈是基于制造用于电动旋转机械的绝缘线圈的方法制造的,其包括将云母带缠绕在线圈导体上以模制绝缘层的步骤,浸渍 在真空和压力条件下使用树脂的线圈,在浸渍有树脂的线圈上附加模制夹具,然后加热浸渍有线圈的树脂以固化树脂,从而制造绝缘线圈。 云母带胶带步骤,热收缩带胶带步骤,在真空和压力下的浸渍步骤,利用液体加热化合物的树脂加热/固化步骤和模制夹具拆卸/精加工步骤进行以制造绝缘线圈 。