公开(公告)号：US20190170699A1

公开(公告)日：2019-06-06

申请号：US16315676

申请日：2017-07-06

Applicant: HITACHI, LTD.

Inventor： Taiichi TAKEZAKI ,  Shuntaro MACHIDA ,  Daisuke RYUZAKI ,  Yasuhiro YOSHIMURA ,  Tatsuya NAGATA ,  Naoaki YAMASHITA

IPC: G01N29/24 ,  A61B8/00 ,  B06B1/02

Abstract: A capacitive micromachined ultrasonic transducer 111A includes: a silicon substrate 101; an insulating film 102 formed over the silicon substrate 101; a lower electrode 103; insulating films 104 and 106; a cavity 105 constituted by a void formed in a portion of the insulating film 106; an upper electrode 107; insulating films 108 and 114; and a protective film 109. In addition, the insulating film 106, upper electrode 107, insulating film 108 and insulating film 114 above the cavity 105 configure a vibration film 110, and the protective film 109 above the vibration film 110 is divided into a plurality of isolated patterns regularly arranged with a gap 115 having a constant spacing formed therebetween.

公开(公告)号：US20200098726A1

公开(公告)日：2020-03-26

申请号：US16310828

申请日：2017-06-20

Applicant: HITACHI, LTD.

Inventor： Yasuhiro YOSHIMURA ,  Akifumi SAKO ,  Naoaki YAMASHITA ,  Tatsuya NAGATA

IPC: H01L25/065 ,  B06B1/02 ,  H01L23/00

Abstract: The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.

公开(公告)号：US20170291192A1

公开(公告)日：2017-10-12

申请号：US15513588

申请日：2015-04-21

Applicant: Hitachi, Ltd.

Inventor： Shuntaro MACHIDA ,  Daisuke RYUZAKI ,  Tatsuya NAGATA ,  Naoaki YAMASHITA ,  Yuko HANAOKA ,  Yasuhiro YOSHIMURA

IPC: B06B1/06

CPC classification number: B06B1/06 ,  A61B8/4461 ,  A61B8/4494 ,  B06B1/0292 ,  B06B1/0607 ,  B06B1/0644 ,  G01N29/043 ,  G01N29/24 ,  G01N29/2406 ,  G01N2291/0232 ,  G01N2291/106 ,  H04R19/005 ,  H04R31/00

Abstract: A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.

公开(公告)号：US20190321002A1

公开(公告)日：2019-10-24

申请号：US16359020

申请日：2019-03-20

Applicant: Hitachi, Ltd.

Inventor： Yasuhiro YOSHIMURA ,  Akifumi SAKO ,  Masahiro SATO

IPC: A61B8/00 ,  G01N29/24

Abstract: According to one embodiment, an ultrasonic probe includes: an oscillator; a base on which the oscillator is provided; a base conductive wire portion connected to the oscillator; a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion; a pad portion engaging with the bump electrode portion; and an acoustic lens provided such that a force toward the bump electrode portion is applied to the pad portion.