公开(公告)号：US20230380068A1

公开(公告)日：2023-11-23

申请号：US18029945

申请日：2021-09-24

Applicant: Hitachi Astemo, Ltd.

Inventor： Takeshi IGARASHI ,  Katsuya OYAMA

IPC: H05K1/18 ,  H01L23/12 ,  H01L23/31 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L23/12 ,  H01L23/3107 ,  H05K3/3431 ,  H05K2201/09372

Abstract: An object of the present invention is to provide an electronic control device capable of improving the connection life and reliability of solder connecting a printed circuit board and a QFN type semiconductor package. For this purpose, a printed circuit board 106 includes a first land 109 connected to a first metal terminal 104 via a solder 107, a second land 110 connected to a second metal terminal 105 via a solder 108, a third land 112 disposed on the outer peripheral side of a semiconductor package 101 with respect to the first land 109, and a resist 113 formed on the third land 112 so as to be in contact with the lower surface of a molding resin 103.