公开(公告)号：US12062591B2

公开(公告)日：2024-08-13

申请号：US17159257

申请日：2021-01-27

申请人： Hitachi Energy Ltd

发明人： Milad Maleki ,  Harald Beyer ,  Dominik Truessel

IPC分类号： H01L23/40 ,  H01L23/31

CPC分类号： H01L23/4006 ,  H01L23/3171 ,  H01L2023/4081 ,  H01L2023/4087

摘要： A power semiconductor module includes a baseplate that has a first region at a first side located adjacent to an edge of the baseplate and proceeding in a first plane. An encapsulation material covers portions of the baseplate so that the first region of the baseplate is free of the encapsulation material and the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material. The baseplate at its first side is configured for being provided with an electric circuit and the baseplate at its second side is configured for being brought into contact to a heat dissipating element by applying a clamping force with a clamping part to the first region.

公开(公告)号：US20240355704A1

公开(公告)日：2024-10-24

申请号：US18762854

申请日：2024-07-03

申请人： Hitachi Energy Ltd

发明人： Milad Maleki ,  Harald Beyer ,  Dominik Truessel

IPC分类号： H01L23/40 ,  H01L23/31

CPC分类号： H01L23/4006 ,  H01L23/3171 ,  H01L2023/4081 ,  H01L2023/4087

摘要： A power semiconductor module includes a baseplate that has a first region at a first side located adjacent to an edge of the baseplate and proceeding in a first plane. An encapsulation material covers portions of the baseplate so that the first region of the baseplate is free of the encapsulation material and the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material. The baseplate at its first side is configured for being provided with an electric circuit and the baseplate at its second side is configured for being brought into contact to a heat dissipating element by applying a clamping force with a clamping part to the first region.