公开(公告)号：US10269533B2

公开(公告)日：2019-04-23

申请号：US14911960

申请日：2014-09-18

Applicant: Hitachi High-Technologies Corporation

Inventor： Takashi Mizuo ,  Yusuke Tamba ,  Haruhiko Hatano ,  Kazutaka Nimura

IPC: B01D8/00 ,  F25B19/00 ,  H01J37/18 ,  F25B45/00 ,  H01J37/16 ,  H01J37/20

Abstract: In conventional structures, a space between a dual cooling tank is vacuum insulated, and a cooling part is cooled via a highly thermally conductive material connected to an inner container. Such structures are affected by heat infiltrating into the highly thermally conductive material and the cooling part. For instance, in cases when liquid nitrogen is used as a coolant, it takes approximately 30 minutes for the temperature to reach −120° C. Even in cases when a significant amount of time has been spent, the temperature only reaches approximately −150° C., and thus falls significantly short of the temperature of liquid nitrogen, namely −196° C. Accordingly, an anti-contamination trap and a vacuum application device according to the present invention are provided with a structure in which a device-internal cooling part in the vacuum application device is cooled, and are characterized by being provided with: a cooling tank filled with a coolant for cooling a cooling part; and a cooling pipe extending from the cooling tank to the vicinity of the cooling part. The anti-contamination trap and the vacuum application device are further characterized in that: the coolant is supplied to an end of the cooling part; and a tube for releasing air bubbles inside the cooling pipe is inserted so as to extend to the cooling part.