公开(公告)号：US20160231516A1

公开(公告)日：2016-08-11

申请号：US14614508

申请日：2015-02-05

申请人： Hitachi Metals, Ltd.

发明人： Yoshinori SUNAGA ,  Kinya YAMAZAKI ,  Yoshiaki ISHIGAMI ,  Chihiro OHKUBO

IPC分类号： G02B6/42 ,  H05K7/02 ,  H05K7/20 ,  G02B6/43

CPC分类号： G02B6/4214 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/43 ,  H05K7/02 ,  H05K7/20418

摘要： Space usable in various usages is ensured between a board and a communication module mounted on the board. A communication module is mounted on a motherboard inside a signal transmission device, and the communication module includes: a module frame having a lower plate and an upper plate facing each other and that contains a module board between the lower plate and the upper plate; and a male connector that is protruded from the lower plate and connected to a female connector provided in the motherboard. When the male connector is connected to the female connector, a gap is formed between the lower plate of the module frame and the motherboard.

摘要翻译： 在板和安装在板上的通信模块之间确保了可用于各种用途的空间。 通信模块安装在信号传输装置内的母板上，通信模块包括：模块框架，具有彼此相对的下板和上板，并且在下板和上板之间包含模块板; 以及阳连接器，其从下板突出并连接到设置在母板中的阴连接器。 当阳连接器连接到阴连接器时，在模块框架的下板和主板之间形成间隙。