公开(公告)号：US20200168355A1

公开(公告)日：2020-05-28

申请号：US16775428

申请日：2020-01-29

Applicant: Hitachi Metals, Ltd.

Inventor： Seigi AOYAMA ,  Toru SUMI ,  Takashi HAYASAKA ,  Ryohei OKADA ,  Detian HUANG ,  Tamotsu SAKURAI ,  Satoshi YAJIMA ,  Minoru TAKATSUTO ,  Hiroshi BANDO

IPC: H01B1/02 ,  H01B11/18 ,  H01B13/016 ,  B22D11/00 ,  C22F1/08

Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

公开(公告)号：US20180197652A1

公开(公告)日：2018-07-12

申请号：US15723643

申请日：2017-10-03

Applicant: Hitachi Metals, Ltd.

Inventor： Seigi AOYAMA ,  Toru SUMI ,  Takashi HAYASAKA ,  Ryohei OKADA ,  Detian HUANG ,  Tamotsu SAKURAI ,  Satoshi YAJIMA ,  Minoru TAKATSUTO ,  Hiroshi BANDO

IPC: H01B1/02 ,  C22F1/08 ,  H01B13/016 ,  H01B11/18 ,  B22D11/00

Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.