公开(公告)号：US20180197652A1

公开(公告)日：2018-07-12

申请号：US15723643

申请日：2017-10-03

Applicant: Hitachi Metals, Ltd.

Inventor： Seigi AOYAMA ,  Toru SUMI ,  Takashi HAYASAKA ,  Ryohei OKADA ,  Detian HUANG ,  Tamotsu SAKURAI ,  Satoshi YAJIMA ,  Minoru TAKATSUTO ,  Hiroshi BANDO

IPC: H01B1/02 ,  C22F1/08 ,  H01B13/016 ,  H01B11/18 ,  B22D11/00

Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

公开(公告)号：US20140302342A1

公开(公告)日：2014-10-09

申请号：US14221188

申请日：2014-03-20

Applicant: Hitachi Metals, Ltd.

Inventor： Seigi AOYAMA ,  Toru Sumi ,  Hideyuki Sagawa ,  Keisuke Fujito ,  Masayoshi Goto ,  Hiroyoshi Hiruta

IPC: C22F1/08 ,  C22C9/00

CPC classification number: C22F1/08 ,  C22C9/00 ,  Y10T428/1266

Abstract: A copper wire includes a copper wire rod including 5 to 55 mass ppm of Ti, 3 to 12 mass ppm of sulfur, and 2 to 30 mass ppm of oxygen with the balance copper and inevitable impurities, a first crystal including a [111] crystal orientation and at least one twin crystal therein, and a second crystal that includes one or more crystals adjacent to the first crystal, a [111] crystal orientation with a different rotation angle on an atomic plane from the first crystal, and at least one twin crystal therein.

Abstract translation: 铜线包括铜线，其包含5〜55质量ppm的Ti，3〜12质量ppm的硫和2〜30质量ppm的氧，余量为铜和不可避免的杂质，含有[111]晶体的第一晶体 取向和其中的至少一个双晶，以及包括与第一晶体相邻的一个或多个晶体的第二晶体，在与第一晶体的原子平面上具有不同旋转角度的[111]晶体取向，以及至少一个双 晶体。

公开(公告)号：US20200168355A1

公开(公告)日：2020-05-28

申请号：US16775428

申请日：2020-01-29

Applicant: Hitachi Metals, Ltd.

Inventor： Seigi AOYAMA ,  Toru SUMI ,  Takashi HAYASAKA ,  Ryohei OKADA ,  Detian HUANG ,  Tamotsu SAKURAI ,  Satoshi YAJIMA ,  Minoru TAKATSUTO ,  Hiroshi BANDO

IPC: H01B1/02 ,  H01B11/18 ,  H01B13/016 ,  B22D11/00 ,  C22F1/08

Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

公开(公告)号：US20140209349A1

公开(公告)日：2014-07-31

申请号：US14091674

申请日：2013-11-27

Applicant: HITACHI METALS, LTD.

Inventor： Hideyuki SAGAWA ,  Seigi AOYAMA ,  Toru SUMI ,  Keisuke FUJITO ,  Detian HUANG

IPC: H01B11/18 ,  H01B13/016

CPC classification number: H01B1/026

Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.

Abstract translation: 高速传输电缆导体包括主要包括铜的芯材和在芯材表面周围形成的表面处理层。 表面处理层包括非晶层，其包括对铜的氧的亲和性高于铜的金属元素和氧。

公开(公告)号：US20140205491A1

公开(公告)日：2014-07-24

申请号：US14140615

申请日：2013-12-26

Applicant: HITACHI METALS, LTD.

Inventor： Keisuke FUJITO ,  Seigi AOYAMA ,  Toru SUMI ,  Hideyuki SAGAWA ,  Yuju ENDO

IPC: H01B1/02 ,  C22C9/00

CPC classification number: H01B1/026 ,  C22C9/00

Abstract: A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33≦M/O≦1.5.

Abstract translation: 铜合金材料包括包含Ti的附加元素M，以及具有铜和不可避免的杂质的余量。 附加元素M与氧的原子比在0.33≤n1E的范围内; M / O和nlE; 1.5。