Semiconductor laser element and manufacturing method thereof
    1.
    发明授权
    Semiconductor laser element and manufacturing method thereof 失效
    半导体激光元件及其制造方法

    公开(公告)号:US07843983B2

    公开(公告)日:2010-11-30

    申请号:US10592943

    申请日:2005-03-16

    摘要: In an element wherein a plurality of ridges (16, 36) are arranged in parallel, supports (17, 37) are formed to sandwich each of the ridges (16, 36). More specifically, on an outer side of the ridge (16) in the element, the first support (17a) is formed, and on an inner side in the element, the second support (17b) is formed. On an outer side of the ridge (36) in the element, the first support (37a) is formed, and on an inner side in the element, the second support (37b) is formed. Thus, even when a resist is applied on an element surface and spin-coating is performed at the time of manufacturing the element, the resist on the inner side than the ridges (16, 36) in the element can be prevented from flowing into a groove between the ridges to a certain extent by means of the second supports (17b, 37b), and a resist film thickness on the inner sides of the ridges (16, 36) in the element can be prevented from being considerably small compared with that on the outer sides in the element.

    摘要翻译: 在其中平行布置多个脊(16,36)的元件中,形成支撑件(17,37)以夹住每个脊(16,36)。 更具体地,在元件中的脊部(16)的外侧上形成有第一支撑件(17a),并且在元件的内侧形成有第二支撑件(17b)。 在元件中的脊(36)的外侧上形成有第一支撑件(37a),并且在元件的内侧形成有第二支撑件(37b)。 因此,即使当在元件表面上施加抗蚀剂并且在制造元件时进行旋转涂覆时,可以防止在内部的内侧的抗蚀剂比元件中的脊(16,36)流入 通过第二支撑件(17b,37b)在一定程度上的脊之间的沟槽以及元件中的脊(16,36)的内侧上的抗蚀剂膜厚度可以被防止与该元件的脊部(16,36)的内侧相比小得多 在元素的外侧。

    Semiconductor Laser Element And Manufacturing Method Thereof
    2.
    发明申请
    Semiconductor Laser Element And Manufacturing Method Thereof 失效
    半导体激光元件及其制造方法

    公开(公告)号:US20070195842A1

    公开(公告)日:2007-08-23

    申请号:US10592943

    申请日:2005-03-16

    IPC分类号: H01S5/00

    摘要: In an element wherein a plurality of ridges (16, 36) are arranged in parallel, supports (17, 37) are formed to sandwich each of the ridges (16, 36). More specifically, on an outer side of the ridge (16) in the element, the first support (17a) is formed, and on an inner side in the element, the second support (17b) is formed. On an outer side of the ridge (36) in the element, the first support (37a) is formed, and on an inner side in the element, the second support (37b) is formed. Thus, even when a resist is applied on an element surface and spin-coating is performed at the time of manufacturing the element, the resist on the inner side than the ridges (16, 36) in the element can be prevented from flowing into a groove between the ridges to a certain extent by means of the second supports (17b, 37b), and a resist film thickness on the inner sides of the ridges (16, 36) in the element can be prevented from being considerably small compared with that on the outer sides in the element.

    摘要翻译: 在其中平行布置多个脊(16,36)的元件中,形成支撑件(17,37)以夹住每个脊(16,36)。 更具体地,在元件中的脊部(16)的外侧上形成有第一支撑件(17a),并且在元件的内侧形成有第二支撑件(17b)。 在元件的脊部(36)的外侧形成有第一支撑体(37a),在该元件的内侧形成有第二支撑体(37b)。 因此,即使当在元件表面上施加抗蚀剂并且在制造元件时进行旋转涂覆时,可以防止在内部的内侧的抗蚀剂比元件中的脊(16,36)流入 通过第二支撑件(17b,37b)在一定程度上的脊之间的凹槽和元件中的脊(16,36)的内侧上的抗蚀剂膜厚度可以被防止相当小 在元素的外侧。