公开(公告)号：US20030060590A1

公开(公告)日：2003-03-27

申请号：US10176335

申请日：2002-06-19

申请人： Honeywell International Inc.

发明人： Kreisler S. Lau ,  Feng Quan Liu ,  Boris A. Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

IPC分类号： C08G065/30 ,  C08G065/38 ,  C08F008/00

CPC分类号： C08G61/02 ,  C08G61/12 ,  C08G65/40 ,  C08G2650/60

摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

公开(公告)号：US20020022708A1

公开(公告)日：2002-02-21

申请号：US09897936

申请日：2001-07-05

申请人： Honeywell International Inc.

发明人： Kreisler Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

IPC分类号： C08G065/00 ,  C08G065/38

CPC分类号： C08G61/12 ,  C08G61/02 ,  C08G2650/60

摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

摘要翻译： 在制造低介电常数聚合物的方法中，提供了一种热固性单体，其中该热固性单体具有笼形化合物或芳基核心结构，以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中，将热固性单体引入聚合物中以形成低介电常数聚合物，其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 考虑的笼状化合物和核心结构包括金刚烷，二金刚烷，硅，苯基和亚噻吩基，而优选的臂包括亚芳基，支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料，并且聚合物的介电常数可以通过改变臂的整个长度来控制。

公开(公告)号：US20020016414A1

公开(公告)日：2002-02-07

申请号：US09902924

申请日：2001-08-20

申请人： Honeywell International Inc.

发明人： Kreisler Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  Roger Leung

IPC分类号： C08F008/00 ,  C08L001/00 ,  C08L071/12 ,  C08L067/00 ,  C08L067/06

CPC分类号： C08F257/02 ,  C08F8/00 ,  C08G61/02 ,  C08G61/12 ,  C08G81/00 ,  C08L51/003 ,  H01B3/307 ,  H01B3/427 ,  C08L2666/02

摘要： A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.

摘要翻译： 低介电常数材料具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一和第二主链通过第一和第二反应性基团在 交联反应而没有额外的交联剂，并且其中具有至少10个原子的笼状结构与第一和第二主链中的至少一个共价结合。