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    Compositions and methods for thermosetting molecules in organic compositions
    3.
    发明授权
    Compositions and methods for thermosetting molecules in organic compositions 失效
    有机组合物中热固性分子的组成和方法

    公开(公告)号：US06803441B2

    公开(公告)日：2004-10-12

    申请号：US10267380

    申请日：2002-10-08

    申请人： Kreisler Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    发明人： Kreisler Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    IPC分类号： C08G6378

    CPC分类号： C08G61/12 ,  C08G61/02 ,  C08G2650/60

    摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

    摘要翻译： 在制造低介电常数聚合物的方法中，提供了一种热固性单体，其中该热固性单体具有笼形化合物或芳基核心结构，以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中，将热固性单体引入聚合物中以形成低介电常数聚合物，其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 考虑的笼状化合物和核心结构包括金刚烷，二金刚烷，硅，苯基和亚噻吩基，而优选的臂包括亚芳基，支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料，并且聚合物的介电常数可以通过改变臂的整个长度来控制。

    Compositions and methods for thermosetting molecules in organic compositions
    5.
    发明申请
    Compositions and methods for thermosetting molecules in organic compositions 失效

    公开(公告)号：US20030060590A1

    公开(公告)日：2003-03-27

    申请号：US10176335

    申请日：2002-06-19

    申请人： Honeywell International Inc.

    发明人： Kreisler S. Lau ,  Feng Quan Liu ,  Boris A. Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    IPC分类号： C08G065/30 ,  C08G065/38 ,  C08F008/00

    CPC分类号： C08G61/02 ,  C08G61/12 ,  C08G65/40 ,  C08G2650/60

    摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

    Acetylenic diol ethylene oxide/propylene oxide adducts and processes for their manufacture
    6.
    发明申请
    Acetylenic diol ethylene oxide/propylene oxide adducts and processes for their manufacture 有权
    乙烯二醇环氧乙烷/环氧丙烷加合物及其制备方法

    公开(公告)号：US20020055660A1

    公开(公告)日：2002-05-09

    申请号：US09975135

    申请日：2001-10-11

    发明人： Kevin Rodney Lassila ,  Paula Ann Uhrin

    IPC分类号： C07C043/11

    CPC分类号： C08G65/2609 ,  C08G2650/60 ,  C11D1/722

    摘要： This invention provides water-based compositions, particularly coating, ink, fountain solution and agricultural compositions, manifesting reduced equilibrium and dynamic surface tension by the incorporation of a surface tension reducing amount of an acetylenic diol ethylene oxide/propylene oxide adduct of the structure 1 where r and t are 1 or 2, (nnullm) is 1 to 30 and (pnullq) is 1 to 30. Also disclosed is a method for making random and block EO/PO adducts of acetylenic diols by reacting an acetylenic diol with EO and/or PO in the presence of a trialkylamine or Lewis acid.

    摘要翻译： 本发明提供水基组合物，特别是涂料，油墨，润版液和农业组合物，通过结合表面张力降低量的结构的炔属二醇环氧乙烷/环氧丙烷加合物表现出减少的平衡和动态表面张力，其中r 并且t为1或2，（n + m）为1〜30，（p + q）为1〜30。另外公开了通过使炔属二醇与 EO和/或PO在三烷基胺或路易斯酸存在下反应。

    Method of preparing polymers with low melt viscosity
    7.
    发明授权
    Method of preparing polymers with low melt viscosity 失效
    制备熔体粘度低的聚合物的方法

    公开(公告)号：US06191252B1

    公开(公告)日：2001-02-20

    申请号：US08666793

    申请日：1996-06-18

    申请人： Brian J. Jensen

    发明人： Brian J. Jensen

    IPC分类号： C08G6926

    CPC分类号： C08G65/4012 ,  C08G75/23 ,  C08G2650/60 ,  Y10T428/31721

    摘要： This invention is an improvement in standard polymerizations procedures, i.e., addition-type and step-growth type polymerizations, wherein momomers are reacted to form a growing polymer chain. The improvement includes employing an effective amount of a trifunctional monomer (such as a trifunctional amine, anhydride, or phenol) in the polymerization procedure to form a mixture of polymeric materials consisting of branced polymers, star-shaped polymers, and linear polymers. This mixture of polymeric materials has a lower melt temperature and a lower melt viscosity than corresponding linear polymeric materials of equivalent molecular weight.

    摘要翻译： 本发明是标准聚合方法的改进，即加成型和阶段生长型聚合，其中单体反应形成生长的聚合物链。 该改进包括在聚合过程中使用有效量的三官能单体（例如三官能胺，酸酐或苯酚）以形成由分支聚合物，星形聚合物和线性聚合物组成的聚合物材料的混合物。 这种聚合物材料的混合物具有比相当于等效分子量的线性聚合物材料更低的熔融温度和更低的熔体粘度。

    Curable resin compound, method for producing the same, and cured-resin material
    8.
    发明授权
    Curable resin compound, method for producing the same, and cured-resin material 失效
    可固化树脂化合物，其制备方法和固化树脂材料

    公开(公告)号：US5864050A

    公开(公告)日：1999-01-26

    申请号：US743997

    申请日：1996-11-04

    申请人： Yoshihiro Taguchi ,  Shiro Kobayashi ,  Hiroshi Uyama ,  Atsushi Nakamura

    发明人： Yoshihiro Taguchi ,  Shiro Kobayashi ,  Hiroshi Uyama ,  Atsushi Nakamura

    IPC分类号： C07C45/68 ,  C07C45/71 ,  C07C49/84 ,  C08F290/06 ,  C08F299/04 ,  C08G65/40 ,  C08G65/48 ,  C08F138/00 ,  C07C49/796

    CPC分类号： C08G65/48 ,  C07C45/68 ,  C07C45/71 ,  C07C49/84 ,  C08G65/4012 ,  C08G2650/20 ,  C08G2650/60 ,  C08L2312/00

    摘要： The present invention provides a curable resin compound which is soluble in organic solvents and easy to use, and a method for producing the same. The curable resin compound comprises a structure and crosslinkable groups which end-cap the structure, the structure comprising three or four non-substituted benzene rings each of which is joined with each adjacent benzene ring by an ether or ketone linkage so that both types of linkages are present in the structure. Though the curable resin compound exhibits satisfactory solubilities in organic solvents, a composition comprising the compound can be cured by a crosslinking reaction to be insoluble in the organic solvents while being provided with improved solvent resistance and chemical resistance. Accordingly, the present invention also provides a cured-resin material derived from the aforementioned curable resin compound, the cured-resin material being excellent in solvent resistance, chemical resistance and thermal resistance.

    摘要翻译： 本发明提供一种可溶于有机溶剂且易于使用的可固化树脂化合物及其制备方法。 可固化树脂化合物包括结构和端基结构的可交联基团，其结构包含三个或四个未取代的苯环，每个苯环通过醚或酮键与每个相邻的苯环连接，使得两种类型的键 存在于结构中。 尽管可固化树脂化合物在有机溶剂中表现出令人满意的溶解性，但是包含该化合物的组合物可以通过交联反应固化而不溶于有机溶剂，同时具有改进的耐溶剂性和耐化学性。 因此，本发明还提供了由上述固化性树脂化合物衍生的固化树脂材料，其耐溶剂性，耐化学性和耐热性优异的固化树脂材料。