公开(公告)号：US20240363477A1

公开(公告)日：2024-10-31

申请号：US18028850

申请日：2022-08-26

Applicant: Honor Device Co., Ltd.

Inventor： Erliang Li ,  Hanghang Dong ,  Junjie Yang

IPC: H01L23/373 ,  G06F1/16 ,  H01L23/367 ,  H05K7/20

CPC classification number: H01L23/3735 ,  H01L23/3675 ,  H01L23/3736 ,  H05K7/20409 ,  G06F1/1613

Abstract: This application discloses a thermal pad, a heat dissipation module, and an electronic device, and relates to the field of thermal pad technologies. The thermal pad includes a pad body. The pad body is provided with a hollowed-out part, and the hollowed-out part is filled with a liquid metal material layer. This application may be applied to electronic devices such as notebook computers.

公开(公告)号：US20240298424A1

公开(公告)日：2024-09-05

申请号：US18044422

申请日：2022-08-29

Applicant: Honor Device Co., Ltd.

Inventor： Hanghang Dong ,  Erliang Li ,  Junjie Yang

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  H05K7/20272 ,  H05K7/20409

Abstract: Disclosed are a method for manufacturing a heat dissipation structure of an electronic element, a heat dissipation structure, and an electronic device. The method includes: covering a periphery of an electronic element with a heat dissipation cover, where the heat dissipation cover is provided with a through hole, and an inner wall of the heat dissipation cover is provided with a plurality of electrodes; injecting a liquid metal through the through hole into an accommodating cavity enclosed by the substrate and the heat dissipation cover until the entire accommodating cavity is filled, and during this period, energizing the electrodes, so that a current flows through the liquid metal to reduce surface tension of the liquid metal; and sealing the through hole.