公开(公告)号：US20240237194A9

公开(公告)日：2024-07-11

申请号：US18041767

申请日：2022-08-26

申请人： Honor Device Co., Ltd.

发明人： Junjie Yang ,  Erliang Li ,  Jian Bai ,  Xiaohang Li

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K9/00

CPC分类号： H05K1/0268 ,  H05K1/116 ,  H05K3/3485 ,  H05K9/0024 ,  H05K2201/035

摘要： This application discloses a circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit. This application may be applied to a terminal device such as a mobile phone.

公开(公告)号：US20240138056A1

公开(公告)日：2024-04-25

申请号：US18041767

申请日：2022-08-25

申请人： Honor Device Co., Ltd.

发明人： Junjie Yang ,  Erliang Li ,  Jian Bai ,  Xiaohang Li

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K9/00

CPC分类号： H05K1/0268 ,  H05K1/116 ,  H05K3/3485 ,  H05K9/0024 ,  H05K2201/035

摘要： This application discloses a circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit. This application may be applied to a terminal device such as a mobile phone.

公开(公告)号：US20240363477A1

公开(公告)日：2024-10-31

申请号：US18028850

申请日：2022-08-26

申请人： Honor Device Co., Ltd.

发明人： Erliang Li ,  Hanghang Dong ,  Junjie Yang

IPC分类号： H01L23/373 ,  G06F1/16 ,  H01L23/367 ,  H05K7/20

CPC分类号： H01L23/3735 ,  H01L23/3675 ,  H01L23/3736 ,  H05K7/20409 ,  G06F1/1613

摘要： This application discloses a thermal pad, a heat dissipation module, and an electronic device, and relates to the field of thermal pad technologies. The thermal pad includes a pad body. The pad body is provided with a hollowed-out part, and the hollowed-out part is filled with a liquid metal material layer. This application may be applied to electronic devices such as notebook computers.

公开(公告)号：US20240298424A1

公开(公告)日：2024-09-05

申请号：US18044422

申请日：2022-08-29

申请人： Honor Device Co., Ltd.

发明人： Hanghang Dong ,  Erliang Li ,  Junjie Yang

IPC分类号： H05K7/20

CPC分类号： H05K7/20263 ,  H05K7/20272 ,  H05K7/20409

摘要： Disclosed are a method for manufacturing a heat dissipation structure of an electronic element, a heat dissipation structure, and an electronic device. The method includes: covering a periphery of an electronic element with a heat dissipation cover, where the heat dissipation cover is provided with a through hole, and an inner wall of the heat dissipation cover is provided with a plurality of electrodes; injecting a liquid metal through the through hole into an accommodating cavity enclosed by the substrate and the heat dissipation cover until the entire accommodating cavity is filled, and during this period, energizing the electrodes, so that a current flows through the liquid metal to reduce surface tension of the liquid metal; and sealing the through hole.