MIDDLE FRAME ASSEMBLY, PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE

    公开(公告)号:US20240388648A1

    公开(公告)日:2024-11-21

    申请号:US18272783

    申请日:2023-01-03

    Abstract: Disclosed is a middle frame assembly, including a middle plate and a frame disposed around an outer edge of the middle plate, where the middle plate includes a first carbon fiber reinforced resin composite material base body and a first metal plating layer compounded on a surface of the base body. Some embodiments of this application further provide a preparation method for a middle frame assembly and an electronic device in the middle frame assembly. Some embodiments of this application use a carbon fiber reinforced resin composite material as a middle plate base body of the middle frame assembly.

    INSULATION ADHESIVE, INSULATION TAPE, AND INSULATION ADHESIVE PREPARATION METHOD

    公开(公告)号:US20240336814A1

    公开(公告)日:2024-10-10

    申请号:US18294379

    申请日:2022-08-19

    CPC classification number: C09J9/00 C09J127/18 G03B17/02 H04N23/51

    Abstract: This application discloses an insulation adhesive, an insulation tape, and an insulation adhesive preparation method. The insulation adhesive includes: an insulation colloid, and an insulation particle doped in the insulation colloid. Breakdown field strength of the insulation particle is greater than breakdown field strength of the insulation colloid. Since the breakdown field strength of the insulation particle is greater than the breakdown field strength of the insulation colloid, the insulation colloid is easier to break down than the insulation particle. When an electro-static discharge current acts on the insulation adhesive, the electro-static discharge current breaks down the insulation colloid that has worse insulation performance and that is easier to break down, and bypasses the insulation particle that has better insulation performance and that is more difficult to break down, so that a breakdown path of the electro-static discharge current becomes longer.

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