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公开(公告)号：US20240388648A1
公开(公告)日：2024-11-21
申请号：US18272783
申请日：2023-01-03
Applicant: Honor Device Co., Ltd.
Inventor： Yin MENG , Jing GAO , Cheng JIANG
Abstract: Disclosed is a middle frame assembly, including a middle plate and a frame disposed around an outer edge of the middle plate, where the middle plate includes a first carbon fiber reinforced resin composite material base body and a first metal plating layer compounded on a surface of the base body. Some embodiments of this application further provide a preparation method for a middle frame assembly and an electronic device in the middle frame assembly. Some embodiments of this application use a carbon fiber reinforced resin composite material as a middle plate base body of the middle frame assembly.
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公开(公告)号：US20240336814A1
公开(公告)日：2024-10-10
申请号：US18294379
申请日：2022-08-19
Applicant: HONOR DEVICE CO., LTD.
Inventor： Tongkai ZHANG , Jing GAO , Yin MENG , Fenxing LEI
IPC: C09J9/00 , C09J127/18 , G03B17/02 , H04N23/51
CPC classification number: C09J9/00 , C09J127/18 , G03B17/02 , H04N23/51
Abstract: This application discloses an insulation adhesive, an insulation tape, and an insulation adhesive preparation method. The insulation adhesive includes: an insulation colloid, and an insulation particle doped in the insulation colloid. Breakdown field strength of the insulation particle is greater than breakdown field strength of the insulation colloid. Since the breakdown field strength of the insulation particle is greater than the breakdown field strength of the insulation colloid, the insulation colloid is easier to break down than the insulation particle. When an electro-static discharge current acts on the insulation adhesive, the electro-static discharge current breaks down the insulation colloid that has worse insulation performance and that is easier to break down, and bypasses the insulation particle that has better insulation performance and that is more difficult to break down, so that a breakdown path of the electro-static discharge current becomes longer.
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公开(公告)号：US20250081421A1
公开(公告)日：2025-03-06
申请号：US18728659
申请日：2023-06-14
Applicant: HONOR DEVICE CO., LTD.
IPC: H05K9/00
Abstract: This application provides a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board, a chip, a shielding cover, and a conductive structure. The circuit board includes a first surface and a second surface that are disposed opposite to each other. The chip is disposed on the first surface. The shielding cover defines accommodation space, a recess is provided on a surface of the shielding cover facing the first surface, and the recess runs through the shielding cover and is communicated with the accommodation space. The conductive structure is located in the recess and connected between a top wall of the recess and the first surface, and orthographic projection of the conductive structure on the circuit board at least partially falls within an orthographic projection range of the chip on the circuit board.
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公开(公告)号：US20240155048A1
公开(公告)日：2024-05-09
申请号：US18279195
申请日：2022-05-09
Applicant: HONOR DEVICE CO., LTD.
Inventor： Yin MENG , Cheng JIANG , Shumin LIU , Feng LIANG
IPC: H04M1/02
CPC classification number: H04M1/0268
Abstract: Provided in embodiments of this application are a transmission assembly and a foldable electronic device. The transmission assembly includes a first transmission assembly. The first transmission assembly is configured for use in a bending area of the foldable electronic device. The first transmission assembly includes at least two first conductive layers and a first transmission layer located between the two first conductive layers. Each first conductive layer includes at least a first conductive fabric, and the first transmission layer includes at least one first signal line. A dielectric layer is further arranged between the first conductive layer and the first transmission layer, and the dielectric layer includes at least a first substrate layer.
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