公开(公告)号：US12255387B2

公开(公告)日：2025-03-18

申请号：US18016836

申请日：2022-08-19

Applicant: Honor Device Co., Ltd.

Inventor： Xuyang Wang ,  Hua Huang

IPC: H01Q1/38 ,  H01F27/29 ,  H02J50/10 ,  H05K1/02

Abstract: An electronic device includes at least a housing, a mainboard, a conductive coil, and a conductive adapter. The housing includes an inner surface and an outer surface provided opposite to each other. The mainboard is arranged on the inner surface. The conductive coil is arranged on the inner surface and is integrally arranged with the housing. The conductive coil includes a winding portion, an outer connection terminal, and an inner connection terminal. In a radial direction of the winding portion, the mainboard is located at an outer side of the winding portion. The outer connection terminal is connected to the winding portion and is located at the outer side of the winding portion. The outer connection terminal is electrically connected to the mainboard.

公开(公告)号：US20240224442A1

公开(公告)日：2024-07-04

申请号：US17913001

申请日：2022-04-28

Applicant: Honor Device Co., Ltd.

Inventor： Yandang Qiao ,  Lizhi Xiong ,  Wei Zhang ,  Xuyang Wang

IPC: H05K5/02

CPC classification number: H05K5/0217

Abstract: An electronic device and a manufacturing method for a middle frame are provided. The electronic device includes a middle frame, and the middle frame includes a bezel and a middle plate. The bezel is of an annular structure and is disposed around an edge of the middle plate, and the bezel includes at least two layers of annular structures. A concavo-convex fit between any two adjacent annular structures in the at least two layers of annular structures is used to locate the annular structure. The at least two layers of annular structures are respectively at least two metal materials of different densities. In this application, in a processing manner of hot forging a composite plate, the bezel, the middle plate, and a rib in the middle frame are an integrated structure, and at least two types of metal are arranged on the bezel at the same time.

公开(公告)号：US20240129395A1

公开(公告)日：2024-04-18

申请号：US18245983

申请日：2022-08-26

Applicant: Honor Device Co., Ltd.

Inventor： Xuyang Wang ,  Wenxing Yao ,  Fenying Li ,  Tianye Liu ,  Yiwei Hou

IPC: H04M1/02

CPC classification number: H04M1/026

Abstract: A bracket, a module assembly, and an electronic device, so as to improve position stability of the module in the electronic device. Two first limiting parts arranged opposite to each other are arranged at two ends of the bracket, a second limiting part is arranged on at least one side of the bracket, and the two first limiting parts and the second limiting part are enclosed to form a mounting position for mounting the module. Both the first limiting parts and the second limiting part may limit the module, so as to limit in all directions and ensure position stability of the module in the bracket. The bracket is further fixed to the electronic device through fixing parts, so that the position stability of the module in the electronic device may be improved.

公开(公告)号：US20230359251A1

公开(公告)日：2023-11-09

申请号：US18246402

申请日：2022-09-07

Applicant: Honor Device Co., Ltd.

Inventor： Yangjie Tang ,  Xuyang Wang ,  Yameng Wei ,  Lei Feng ,  Xuewen Yin ,  Linquan Ping

IPC: H04M1/03 ,  H04M1/02 ,  G06F1/16 ,  H04R1/02

CPC classification number: G06F1/1658 ,  G06F1/1688 ,  H04M1/026 ,  H04M1/03 ,  H04R1/025 ,  H04R2499/11

Abstract: An electronic device may include a mobile phone, a tablet computer, a handheld computer, a walkie-talkie, a POS machine, an event data recorder, a wearable device, a virtual reality device, or in-vehicle original equipment or another terminal product with a loudspeaker. An inner wall of a mounting cavity for mounting a loudspeaker and the loudspeaker are respectively provided with mating surfaces that adapt to each other. In the two mating surfaces, one is provided with a flexible sealing member and a limiting structure, and the other is provided with a rigid sealing member. When the loudspeaker is mounted, the rigid sealing member can move relative to the flexible sealing member along a first direction, until the rigid sealing member is mated with the flexible sealing member. The limiting structure can restrict the flexible sealing member from moving.

公开(公告)号：US20250088578A1

公开(公告)日：2025-03-13

申请号：US18552301

申请日：2023-05-06

Applicant: Honor Device Co., Ltd.

Inventor： Xuyang Wang

IPC: H04M1/02

Abstract: Embodiments of this application relate to the technical field of electronics, and provide an electronic device. The electronic device includes: a middle frame; a housing assembly, including a battery cover, where the battery cover is arranged on the middle frame; and a printed circuit board, located between the battery cover and the middle frame.

公开(公告)号：US20240422251A1

公开(公告)日：2024-12-19

申请号：US18705298

申请日：2023-05-05

Applicant: HONOR DEVICE CO., LTD.

Inventor： Chengjie Gao ,  Xuyang Wang ,  Wenbo Wu

IPC: H04M1/02 ,  B28B11/00 ,  B28B11/24 ,  B28B23/00 ,  C04B35/653 ,  C04B41/00 ,  C04B41/45

Abstract: This application provides a 5D ceramic housing structure and a 5D ceramic processing process method, to resolve a problem that long processing time of existing CNC and polishing results in high production costs of a housing of an electronic device and low production efficiency. The method includes: obtaining a raw ceramic material, that is, a ceramic powder; performing casting processing on the raw ceramic material to obtain a to-be-sintered green-state ceramic sheet; performing flat ceramic sheet pre-sintering on the green-state ceramic sheet to obtain a sintered product with a shrinkage rate of 18% to 23%; performing 5D heat-bend forming on the sintered product, to enable the sintered product to be further crystallized and deformed by heating to form a ceramic housing; performing fiber adhesion on the ceramic housing; and forming a 5D ceramic housing structure.

公开(公告)号：US12166521B2

公开(公告)日：2024-12-10

申请号：US17764290

申请日：2020-10-27

Applicant: Honor Device Co., Ltd.

Inventor： Renwei Guo ,  Yangjie Tang ,  Xuyang Wang

IPC: H04B1/3888

Abstract: This application provides an electronic device, including a first cover, a first shell, and a second shell. The first cover includes a first side portion, a middle portion, and a second side portion. The middle portion is connected between the first side portion and the second side portion. The first side portion and the second side portion are spaced apart from and opposite to each other to form an opening. The first side portion, the middle portion, and the second side portion are enclosed to form an accommodating cavity. The first shell and the second shell are both mounted in the accommodating cavity. The first shell and the second shell are matched to support the first cover. The solution of this application can resolve the problem of difficulty in assembling the shells with an exterior part.