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公开(公告)号：US20240300225A1
公开(公告)日：2024-09-12
申请号：US18245073
申请日：2022-09-06
Applicant: Honor Device Co., Ltd.
Inventor： Chengjie Gao
CPC classification number: B32B27/12 , B32B5/024 , B32B5/263 , B32B27/365 , H04M1/0283 , B32B2255/10 , B32B2255/28 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/308 , B32B2307/4023 , B32B2307/412 , B32B2307/54 , B32B2457/10
Abstract: This application provides a housing assembly, including a woven glass fiber plate layer, a cover layer, and a highlight layer that are sequentially laminated; a heat shrinkage difference between the woven glass fiber plate layer and the cover layer does not exceed 20%; a thickness of the cover layer is less than 0.2 mm; and a light transmittance of the cover layer is less than 0.05%.
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公开(公告)号：US20240422251A1
公开(公告)日：2024-12-19
申请号：US18705298
申请日：2023-05-05
Applicant: HONOR DEVICE CO., LTD.
Inventor： Chengjie Gao , Xuyang Wang , Wenbo Wu
Abstract: This application provides a 5D ceramic housing structure and a 5D ceramic processing process method, to resolve a problem that long processing time of existing CNC and polishing results in high production costs of a housing of an electronic device and low production efficiency. The method includes: obtaining a raw ceramic material, that is, a ceramic powder; performing casting processing on the raw ceramic material to obtain a to-be-sintered green-state ceramic sheet; performing flat ceramic sheet pre-sintering on the green-state ceramic sheet to obtain a sintered product with a shrinkage rate of 18% to 23%; performing 5D heat-bend forming on the sintered product, to enable the sintered product to be further crystallized and deformed by heating to form a ceramic housing; performing fiber adhesion on the ceramic housing; and forming a 5D ceramic housing structure.
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公开(公告)号：US12271073B2
公开(公告)日：2025-04-08
申请号：US17923140
申请日：2022-04-27
Applicant: Honor Device Co., Ltd.
Inventor： Chengjie Gao
IPC: G02F1/1333 , C23C14/08 , C23C14/10 , C23C14/14 , G02F1/1334 , G02F1/1335
Abstract: A back cover and a processing method thereof, and an electronic device are disclosed, which relate to the field of electronic product technologies, so as to resolve a problem that air bubbles may be easily generated between a cover plate and an electrochromic film layer when the electrochromic film layer is laminated to the cover plate. The electronic device includes a back cover, and the back cover includes: a transparent cover plate, the electrochromic film layer, and a shielding part. The electrochromic film layer and the transparent cover plate are laminated. The shielding part is disposed between an edge part of the electrochromic film layer and the transparent cover plate, and a thickness of the shielding part is less than 4 microns.
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公开(公告)号：US20240198635A1
公开(公告)日：2024-06-20
申请号：US17910104
申请日：2022-04-18
Applicant: Honor Device Co., Ltd.
Inventor： Wenlong Huo , Bangshi Yin , Wenbo Wu , Chengjie Gao
CPC classification number: B32B15/14 , B32B3/30 , B32B5/02 , B32B7/02 , B32B7/12 , B32B9/025 , B32B9/041 , H04M1/0266 , B32B2260/021 , B32B2260/046 , B32B2307/7376 , B32B2457/00
Abstract: A back cover of an electronic device and an electronic device are provided. The back cover of the electronic device includes: a first structure layer including a first region and a second region, where a thickness of the first region is greater than a thickness of the second region, the second region forms a second region orthographic projection along a thickness direction of the electronic device, a battery of the electronic device forms a battery orthographic projection along the thickness direction of the electronic device, and the second region orthographic projection includes the battery orthographic projection. The back cover can be adapted to a middle frame of an electronic device with a glass back cover.
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