公开(公告)号：US20240129395A1

公开(公告)日：2024-04-18

申请号：US18245983

申请日：2022-08-26

Applicant: Honor Device Co., Ltd.

Inventor： Xuyang Wang ,  Wenxing Yao ,  Fenying Li ,  Tianye Liu ,  Yiwei Hou

IPC: H04M1/02

CPC classification number: H04M1/026

Abstract: A bracket, a module assembly, and an electronic device, so as to improve position stability of the module in the electronic device. Two first limiting parts arranged opposite to each other are arranged at two ends of the bracket, a second limiting part is arranged on at least one side of the bracket, and the two first limiting parts and the second limiting part are enclosed to form a mounting position for mounting the module. Both the first limiting parts and the second limiting part may limit the module, so as to limit in all directions and ensure position stability of the module in the bracket. The bracket is further fixed to the electronic device through fixing parts, so that the position stability of the module in the electronic device may be improved.

公开(公告)号：US20240284636A1

公开(公告)日：2024-08-22

申请号：US18043840

申请日：2022-08-19

Applicant: Honor Device Co., Ltd.

Inventor： Hong Zhang ,  Shaohong Dong ,  Yandang Qiao ,  Fenying Li

IPC: H05K7/20 ,  G06F1/20 ,  H05K9/00

CPC classification number: H05K7/20336 ,  G06F1/203 ,  G06F1/206 ,  H05K9/0024 ,  H05K9/0026

Abstract: An embodiment of this application provides an electronic device. The electronic device includes at least a mainboard, electronic components, and a shielding assembly. The shielding assembly includes a shielding case, a capillary structure, and a thermally conductive plate. The electronic components are located in the shielding case and connected to the shielding case. The thermally conductive plate is located on a side of the shielding case that faces away from the electronic components. The thermally conductive plate is connected to the shielding case to form a sealing cavity. The capillary structure is disposed in the sealing cavity. The sealing cavity is filled with a working substance. The sealing cavity includes a vaporization zone and a condensation zone. The vaporization zone is located above the electronic components. The capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone.