Electronic Device
    2.
    发明申请

    公开(公告)号:US20220377162A1

    公开(公告)日:2022-11-24

    申请号:US17763336

    申请日:2021-02-01

    Abstract: This application relates to the field of electronic device technologies, and in particular, to an electronic device. The electronic device includes a housing, a camera module, and a decorative part. The housing is provided with a mounting hole. The camera module includes a lens and a module body connected to the lens. The decorative part includes a decorative part body and a skirt structure connected to the decorative part body. The decorative part body is disposed on the periphery of the lens and disposed in the mounting hole. The skirt structure is provided with a notch. The notch is opposite to the module body. An orthographic projection of a part of the module body opposite to the notch onto a plane of the skirt structure does not fall into the skirt structure. In the electronic device provided in this application, the skirt structure of the decorative part is provided with the notch, and the orthographic projection of the part of the module body opposite to the notch onto the plane of the skirt structure is located does not fall into the skirt structure. This ensures that the skirt structure of the decorative part does not interfere with the camera module, and ensures that the camera module is less prone to being damaged by the skirt structure.

    Camera Decoration Assembly and Mobile Terminal Device

    公开(公告)号:US20240388775A1

    公开(公告)日:2024-11-21

    申请号:US17789606

    申请日:2022-01-17

    Abstract: This application provides a camera decoration assembly. The camera decoration assembly includes a decoration member, a mounting member and a fastener. The decoration member is exposed from a housing; and the decoration member and the mounting member are connected through the fastener or buckling, and are pressed on two opposite sides of the housing respectively. The mounting member includes a body and a conductor embedded in the body; and the conductor is of a metal structure, and is partially exposed from the body to be electrically connected to the decoration member and grounded. In the camera decoration assembly, the decoration member is mounted from outside of the housing, and the mounting member is mounted from inside of the housing, and is connected to the decoration member through the fastener or buckling. An appearance size of the decoration member located outside the housing is not limited by a size and a layout of an internal structure of a mobile terminal device. This application further provides a mobile terminal device including the camera decoration assembly.

    Screen Module, Display Assembly, and Electronic Device

    公开(公告)号:US20240177641A1

    公开(公告)日:2024-05-30

    申请号:US17790347

    申请日:2022-02-10

    CPC classification number: H05K5/03 G09G3/035

    Abstract: A screen module uses a bendable display panel including a first panel layer and a second panel layer. A support layer is located between the first panel layer and the second panel layer. The first panel layer and the second panel layer are connected by a bent region, and a thickness of the support layer close to the bent region is greater than a thickness of a first region of the support layer. A projection of the first region of the support layer on the first panel layer overlaps with a projection of a display driver chip on the first panel layer. After being stacked, the thickness of the screen module may be reduced to meet the user's requirement for a small thickness of an electronic device.

    Screen module, display assembly, and electronic device

    公开(公告)号:US12223870B2

    公开(公告)日:2025-02-11

    申请号:US17790347

    申请日:2022-02-10

    Abstract: A screen module uses a bendable display panel including a first panel layer and a second panel layer. A support layer is located between the first panel layer and the second panel layer. The first panel layer and the second panel layer are connected by a bent region, and a thickness of the support layer close to the bent region is greater than a thickness of a first region of the support layer. A projection of the first region of the support layer on the first panel layer overlaps with a projection of a display driver chip on the first panel layer. After being stacked, the thickness of the screen module may be reduced to meet the user's requirement for a small thickness of an electronic device.

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