公开(公告)号：US12219714B2

公开(公告)日：2025-02-04

申请号：US17756606

申请日：2022-01-18

Applicant: Honor Device Co., Ltd.

Inventor： Yihe Zhang ,  Jiuliang Gao ,  Zhandong Li

IPC: H05K1/18 ,  H05K3/34

Abstract: A terminal device comprises a component and a circuit board. The circuit board comprises a circuit substrate and a solder mask layer, and wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer. Openings with different depths are provided in the circuit board, and at least part of the component is accommodated in or arranged corresponding to the opening. This lowers an installation height between the component and the circuit board without affecting their performance.

公开(公告)号：US20240172367A1

公开(公告)日：2024-05-23

申请号：US17756606

申请日：2022-01-18

Applicant: Honor Device Co., Ltd.

Inventor： Yihe Zhang ,  Jiuliang Gao ,  Zhandong Li

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/183 ,  H05K3/3452 ,  H05K2201/10121

Abstract: A terminal device comprises a component and a circuit board. The circuit board comprises a circuit substrate and a solder mask layer, and wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer. Openings with different depths are provided in the circuit board, and at least part of the component is accommodated in or arranged corresponding to the opening. This lowers an installation height between the component and the circuit board without affecting their performance.