Microstructure arrangement for gripping low coefficient of friction materials

    公开(公告)号:US11273557B2

    公开(公告)日:2022-03-15

    申请号:US17113623

    申请日:2020-12-07

    申请人: Hoowaki, LLC

    IPC分类号: B25J15/00 B22F7/08 B22F5/00

    摘要: A microstructure arrangement having a substrate; a first set of pillars having a cross section area in the range of 10 μm2 to 400 μm2 and a pitch in the range of 20 μm to 1000 μm; a second set of pillars disposed on said first set of pillars having a cross section area less than that of the pillars in said first set of pillars; wherein said second set of pillars are defined by pillars each having a cross section width from 0.5 μm to 100 μm and a pitch in the range of 1 μm to 200 μm; and, wherein said first and second set of pillars are configured to cooperate to have a physical property of a grip force in excess of 50.0N with a contact area of 25% or less, as determined by the friction testing method.

    Microstructure arrangement for gripping low coefficient of friction materials

    公开(公告)号:US10377044B2

    公开(公告)日:2019-08-13

    申请号:US15674291

    申请日:2017-08-10

    申请人: Hoowaki, LLC

    IPC分类号: B25J15/00 B22F5/00 B22F7/08

    摘要: A microstructure arrangement for gripping low coefficient material comprising: a substrate disposed on a gripping surface; a set of pillars disposed on the substrate; and, wherein the set of pillars have the physical property of a grip force in excess of 50.0N with a contact area of 25% or less as determined by the friction testing method. A first set of pillars can be disposed on the substrate having a cross section area in the range of 100 μm2 to 160,000 μm2, height relative to the substrate in the range of 10 μm to 400 μm, and a pitch determined from the center of the pillars, in the range of 20 μm to 1000 μm; and a secondary set of pillars disposed on the first set of pillars having a cross section area less than that of the pillars in the first set of pillars.

    MICROSTRUCTURE ARRANGEMENT FOR GRIPPING LOW COEFFICIENT OF FRICTION MATERIALS

    公开(公告)号:US20180043546A1

    公开(公告)日:2018-02-15

    申请号:US15674291

    申请日:2017-08-10

    申请人: Hoowaki, LLC

    IPC分类号: B25J15/00 B22F5/00

    摘要: A microstructure arrangement for gripping low coefficient material comprising: a substrate disposed on a gripping surface; a set of pillars disposed on the substrate; and, wherein the set of pillars have the physical property of a grip force in excess of 50.0N with a contact area of 25% or less as determined by the friction testing method. A first set of pillars can be disposed on the substrate having a cross section area in the range of 100 μm2 to 160,000 μm2, height relative to the substrate in the range of 10 μm to 400 μm, and a pitch determined from the center of the pillars, in the range of 20 μm to 1000 μm; and a secondary set of pillars disposed on the first set of pillars having a cross section area less than that of the pillars in the first set of pillars.

    MICROSTRUCTURE ARRANGEMENT FOR GRIPPING LOW COEFFICIENT OF FRICTION MATERIALS

    公开(公告)号:US20220168904A1

    公开(公告)日:2022-06-02

    申请号:US17672049

    申请日:2022-02-15

    申请人: Hoowaki, LLC

    IPC分类号: B25J15/00 B22F7/08 B22F5/00

    摘要: A microstructure arrangement having a substrate; a set of pillars having a cross section area in the range of 10 μm2 to 160,000 μm2 and a pitch in the range of 20 μm to 1000 μm. The set of pillars can be on a set of pillars having a cross section area less than that of the pillars. The set of pillars can be defined by pillars each having a cross section width from 0.5 μm to 100 μm and a pitch in the range of 1 μm to 200 μm; and, wherein the set of pillars can be configured to cooperate to have a physical property of a grip force in excess of 50.0 N with a contact area of 25% or less, as determined by the friction testing method.

    Microstructure arrangement for gripping low coefficient of friction materials

    公开(公告)号:US10889005B2

    公开(公告)日:2021-01-12

    申请号:US16451741

    申请日:2019-06-25

    申请人: Hoowaki, LLC

    IPC分类号: B25J15/00 B22F7/08 B22F5/00

    摘要: A microstructure arrangement for gripping low coefficient material comprising: a substrate disposed on a gripping surface; a set of pillars disposed on the substrate; and, wherein the set of pillars have the physical property of a grip force in excess of 50.0N with a contact area of 25% or less as determined by the friction testing method. A first set of pillars can be disposed on the substrate having a cross section area in the range of 100 μm2 to 160,000 μm2, height relative to the substrate in the range of 10 μm to 400 μm, and a pitch determined from the center of the pillars, in the range of 20 μm to 1000 μm; and a secondary set of pillars disposed on the first set of pillars having a cross section area less than that of the pillars in the first set of pillars.

    MICROSTRUCTURE ARRANGEMENT FOR GRIPPING LOW COEFFICIENT OF FRICTION MATERIALS

    公开(公告)号:US20210086371A1

    公开(公告)日:2021-03-25

    申请号:US17113623

    申请日:2020-12-07

    申请人: Hoowaki, LLC

    IPC分类号: B25J15/00 B22F7/08 B22F5/00

    摘要: A microstructure arrangement having a substrate; a first set of pillars having a cross section area in the range of 10 μm2 to 400 μm2 and a pitch in the range of 20 μm to 1000 μm; a second set of pillars disposed on said first set of pillars having a cross section area less than that of the pillars in said first set of pillars; wherein said second set of pillars are defined by pillars each having a cross section width from 0.5 μm to 100 μm and a pitch in the range of 1 μm to 200 μm; and, wherein said first and second set of pillars are configured to cooperate to have a physical property of a grip force in excess of 50.0N with a contact area of 25% or less, as determined by the friction testing method.

    MICROSTRUCTURE ARRANGEMENT FOR GRIPPING LOW COEFFICIENT OF FRICTION MATERIALS

    公开(公告)号:US20190314999A1

    公开(公告)日:2019-10-17

    申请号:US16451741

    申请日:2019-06-25

    申请人: Hoowaki, LLC

    IPC分类号: B25J15/00 B22F7/08 B22F5/00

    摘要: A microstructure arrangement for gripping low coefficient material comprising: a substrate disposed on a gripping surface; a set of pillars disposed on the substrate; and, wherein the set of pillars have the physical property of a grip force in excess of 50.0N with a contact area of 25% or less as determined by the friction testing method. A first set of pillars can be disposed on the substrate having a cross section area in the range of 100 μm2 to 160,000 μm2, height relative to the substrate in the range of 10 μm to 400 μm, and a pitch determined from the center of the pillars, in the range of 20 μm to 1000 μm; and a secondary set of pillars disposed on the first set of pillars having a cross section area less than that of the pillars in the first set of pillars.

    MICROSTRUCTURE ARRANGEMENT FOR GRIPPING LOW COEFFICIENT OF FRICTION MATERIALS

    公开(公告)号:US20180043545A1

    公开(公告)日:2018-02-15

    申请号:US15673727

    申请日:2017-08-10

    申请人: Hoowaki, LLC

    IPC分类号: B25J15/00

    摘要: A microstructure arrangement for gripping low coefficient material comprising: a substrate disposed on a gripping surface; a set of pillars disposed on the substrate; and, wherein the set of pillars have the physical property of a grip force in excess of 50.0N with a contact area of 25% or less as determined by the friction testing method. A first set of pillars can be disposed on the substrate having a cross section area in the range of 100 μm2 to 160,000 μm2, height relative to the substrate in the range of 10 μm to 400 μm, and a pitch determined from the center of the pillars, in the range of 20 μm to 1000 μm; and a secondary set of pillars disposed on the first set of pillars having a cross section area less than that of the pillars in the first set of pillars.