公开(公告)号：US07183631B2

公开(公告)日：2007-02-27

申请号：US10968187

申请日：2004-10-20

Applicant: Hsiao-Tung Ku

Inventor： Hsiao-Tung Ku

IPC: H01L23/495

CPC classification number: H01L23/4952 ,  H01L23/49548 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/16245 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A package structure that uses a bump posited type lead frame is disclosed. The package structure uses a lead frame having holes thereon for accommodating conductive bumps of a chip or a positioning film having openings thereon for accommodating conductive bumps of a chip or both to avoid the flow and deformation of the conductive bumps during bonding so as to prevent the electrical property of the package structure from degradation and increase the reliability of the chip package.

Abstract translation: 公开了一种使用凸点式引线框的封装结构。 封装结构使用其上具有孔的引线框架，用于容纳芯片的导电凸块或其上具有开口的定位膜，用于容纳芯片或两者的导电凸块，以避免接合期间导电凸块的流动和变形，从而防止 封装结构的电性能劣化，提高芯片封装的可靠性。

公开(公告)号：US20060081969A1

公开(公告)日：2006-04-20

申请号：US10968187

申请日：2004-10-20

Applicant: Hsiao-Tung Ku

Inventor： Hsiao-Tung Ku

IPC: H01L23/02 ,  H01L23/52 ,  H01L23/48

CPC classification number: H01L23/4952 ,  H01L23/49548 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/16245 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A package structure that uses a bump posited type lead frame is disclosed. The package structure uses a lead frame having holes thereon for accommodating conductive bumps of a chip or a positioning film having openings thereon for accommodating conductive bumps of a chip or both to avoid the flow and deformation of the conductive bumps during bonding so as to prevent the electrical property of the package structure from degradation and increase the reliability of the chip package.

Abstract translation: 公开了一种使用凸点式引线框的封装结构。 封装结构使用其上具有孔的引线框架，用于容纳芯片的导电凸块或其上具有开口的定位膜，用于容纳芯片或两者的导电凸块，以避免接合期间导电凸块的流动和变形，从而防止 封装结构的电性能劣化，提高芯片封装的可靠性。