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公开(公告)号:US20090207036A1
公开(公告)日:2009-08-20
申请号:US12109588
申请日:2008-04-25
申请人: Hsuan-Chung Ko , Chen-Yang Hsieh
发明人: Hsuan-Chung Ko , Chen-Yang Hsieh
IPC分类号: G08B21/00
CPC分类号: H04B1/1036
摘要: The present invention provides an automatic detecting device for radio frequency environment used to detect radio frequency noise. The device uses an antenna to receive radio frequency noise and the radio frequency noise is passing a radio frequency comparator and transformed into a voltage signal. Then, the voltage signal passes through an amplifier and is amplified to be an output voltage. If the output voltage exceeds a threshold voltage, it drives a post stage circuit to warn when the radio frequency noise is beyond a normal value.
摘要翻译: 本发明提供一种用于检测射频噪声的用于射频环境的自动检测装置。 该设备使用天线接收射频噪声,射频噪声通过射频比较器并变换成电压信号。 然后,电压信号通过放大器并被放大为输出电压。 如果输出电压超过阈值电压,则驱动后级电路,以便在射频噪声超出正常值时发出警告。
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公开(公告)号:US07834775B2
公开(公告)日:2010-11-16
申请号:US12109588
申请日:2008-04-25
申请人: Hsuan-Chung Ko , Chen-Yang Hsieh
发明人: Hsuan-Chung Ko , Chen-Yang Hsieh
IPC分类号: G08B21/00
CPC分类号: H04B1/1036
摘要: The present invention provides an automatic detecting device for radio frequency environment used to detect radio frequency noise. The device uses an antenna to receive radio frequency noise and the radio frequency noise is passing a radio frequency comparator and transformed into a voltage signal. Then, the voltage signal passes through an amplifier and is amplified to be an output voltage. If the output voltage exceeds a threshold voltage, it drives a post stage circuit to warn when the radio frequency noise is beyond a normal value.
摘要翻译: 本发明提供一种用于检测射频噪声的用于射频环境的自动检测装置。 该设备使用天线接收射频噪声,射频噪声通过射频比较器并变换成电压信号。 然后,电压信号通过放大器并被放大为输出电压。 如果输出电压超过阈值电压,则驱动后级电路,以便在射频噪声超出正常值时发出警告。
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公开(公告)号:US07688093B2
公开(公告)日:2010-03-30
申请号:US12153728
申请日:2008-05-23
申请人: Hsuan-Chung Ko , Chen-Yang Hsieh
发明人: Hsuan-Chung Ko , Chen-Yang Hsieh
IPC分类号: G01R31/02
CPC分类号: G01R31/2889
摘要: The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig. The device interface board comprises a chip test area and a second public signal area, in which the chip test area is used to carry a chip under test and is electrically connected with the second public signal area, whereby, through electrical connection between the device interface board and the first public signal area of each of the plurality of probe cards, test signals are transferred between the testing jig and the chip under test, and testing of chips under test having the same model are accomplished between different testing jigs.
摘要翻译: 本发明涉及一种用于测试芯片的设备接口板,其与多个探针卡中的一个配合地安装。 多个探针卡中的每一个具有指定的布线区域和第一公共信号区域,所述指定布线区域与第一公共信号区域电连接。 多个探针卡中的每一个的第一公共信号区域位于相同的特定区域中,并且多个探针卡中的每一个的指定布线区域与测试夹具电连接,并且根据不同的测试夹具而不同 。 设备接口板包括芯片测试区域和第二公共信号区域,其中芯片测试区域用于承载被测芯片并且与第二公共信号区域电连接,由此通过设备接口之间的电连接 板和每个探针卡的第一公共信号区域,测试信号在测试夹具和被测芯片之间传递,并且在不同测试夹具之间实现具有相同模型的芯片的测试。
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公开(公告)号:US20090184719A1
公开(公告)日:2009-07-23
申请号:US12135983
申请日:2008-06-09
申请人: Hsuan-Chung Ko , Chen-Yang Hsieh
发明人: Hsuan-Chung Ko , Chen-Yang Hsieh
CPC分类号: G01R29/0821 , G01R29/0814 , G01R31/002 , G01R31/2822 , G01R31/311
摘要: A device and method for investigating the IC (integrated circuit) testing environment is disclosed herein. The investigative device comprises a loadboard, a socket and an antenna. The loadboard is disposed in the bottom of the investigative device. The socket is disposed over the loadboard. The socket is used to fasten the element under test (such as IC) and the element under test is electrically connected to the loadboard. The antenna is also disposed in a position over the loadboard and closed to the socket. The purpose to dispose the antenna is to receive the wireless signal and monitor the testing environment if there is too much noise around the testing environment to jam the IC testing.
摘要翻译: 本文公开了用于研究IC(集成电路)测试环境的装置和方法。 调查装置包括装载板,插座和天线。 装载板放置在调查装置的底部。 插座设置在装载板上。 该插座用于固定被测元件(如IC),并且被测元件与负载板电连接。 天线也设置在装载板上方的一个位置,并且与插座相连。 配置天线的目的是为了接收无线信号并监测测试环境,如果测试环境周围的噪声太大,以阻止IC测试。
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公开(公告)号:US20090153162A1
公开(公告)日:2009-06-18
申请号:US12153728
申请日:2008-05-23
申请人: Hsuan-Chung Ko , Chen-Yang Hsieh
发明人: Hsuan-Chung Ko , Chen-Yang Hsieh
IPC分类号: G01R1/073
CPC分类号: G01R31/2889
摘要: The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig. The device interface board comprises a chip test area and a second public signal area, in which the chip test area is used to carry a chip under test and is electrically connected with the second public signal area, whereby, through electrical connection between the device interface board and the first public signal area of each of the plurality of probe cards, test signals are transferred between the testing jig and the chip under test, and testing of chips under test having the same model are accomplished between different testing jigs.
摘要翻译: 本发明涉及一种用于测试芯片的设备接口板,其与多个探针卡中的一个配合地安装。 多个探针卡中的每一个具有指定的布线区域和第一公共信号区域,所述指定布线区域与第一公共信号区域电连接。 多个探针卡中的每一个的第一公共信号区域位于相同的特定区域中,并且多个探针卡中的每一个的指定布线区域与测试夹具电连接,并且根据不同的测试夹具而不同 。 设备接口板包括芯片测试区域和第二公共信号区域,其中芯片测试区域用于承载被测芯片并且与第二公共信号区域电连接,由此通过设备接口之间的电连接 板和每个探针卡的第一公共信号区域,测试信号在测试夹具和被测芯片之间传递,并且在不同测试夹具之间实现具有相同模型的芯片的测试。
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