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公开(公告)号：US20190027423A1
公开(公告)日：2019-01-24
申请号：US16140522
申请日：2018-09-24
发明人： Linfang JIN , Yongwang XIAO , Guopin WANG , Jie ZOU , Hualin LI
IPC分类号： H01L23/427 , H01L23/367 , H01L23/552 , H01L23/373
摘要： The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
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公开(公告)号：US20180150115A1
公开(公告)日：2018-05-31
申请号：US15878017
申请日：2018-01-23
发明人： Xiangyang YANG , Linfang JIN , Hualin LI , Wenbing TANG , Jie ZOU
CPC分类号： G06F1/203 , G06F1/1626 , H05K1/0203 , H05K7/2039 , H05K9/0024
摘要： A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder, and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.
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