公开(公告)号：US20130102113A1

公开(公告)日：2013-04-25

申请号：US13710764

申请日：2012-12-11

Applicant: Huawei Device Co., Ltd.

Inventor： Xiong YANG

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L25/165 ,  H01L2924/0002 ,  Y10T428/239 ,  H01L2924/00

Abstract: Embodiments of the present invention disclose a method for encapsulating a component with plastic and its encapsulation structure, which belong to the plastic encapsulation technology field. The method includes: processing, by using the surface mounting technology, a first surface of a part to be encapsulated with plastic and/or performing die bonding on the first surface; encapsulating, with plastic, the first surface of the part to be encapsulated with plastic a second surface of the part to be encapsulated with plastic the first surface and/or performing die bonding in the second face; and encapsulating, with plastic, the second surface of the part to be encapsulated with plastic. This encapsulation structure includes a substrate, where components are fixed on an upper surface and a lower surface of the substrate, and the components on the upper surface and lower surface are all encapsulated with plastic in seal.

Abstract translation: 本发明的实施例公开了一种用塑料封装组件及其封装结构的方法，它们属于塑料封装技术领域。 该方法包括：通过使用表面安装技术处理待塑料部件的第一表面和/或在第一表面上执行芯片接合; 用塑料封装要用塑料封装的部件的第一表面，待塑料部件的第二表面将第一表面和/或在第二面中进行芯片粘合; 并用塑料封装要用塑料封装的部件的第二表面。 该封装结构包括基板，其中部件固定在基板的上表面和下表面上，并且上表面和下表面上的部件都用塑料密封封装。